Operation manual for Narrow-pitch connectors F4S
Panasonic Corporation
industrial.panasonic.com/ac/e/
©
Panasonic Corporation 2017
ACCTF5E-5 201704
- 12 -
4)
Metal Mask Design
Since this connector is designed with an ultra low-profile, pay attention to the
following precautions for reflow soldering.
(1)In addition to the amount of applied solder, the reflow-soldering environment and
temperature profile affect the finish quality after reflow soldering. Make sure to
adjust the amount of solder applied after checking the finish quality in a test run.
(2)Compared with natural air reflow soldering, N2 reflow soldering can reduce
oxidization of the melted solder surface. This significantly improves the solder
wettability. Therefore, make sure to apply an appropriate amount of solder.
(3)
Do not apply
an excessive amount of solder
,
otherwise, solder or flux may creep
near the contact section and reduce contact reliability or cause interference during
mating. Pay careful attention.
(4)It is recommended that solder with a grain diameter of 40
μ
m or smaller is used
so as to print a constant amount of solder.
(5)Check the latest specifications for the metal mask pattern.
Refer to the following pages for the current related dimensions.
