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GENERAL GUIDELINES
1. When servicing, observe the original lead dress. If a
short circuit is found, replace all parts which have been
over-heated or damaged by the short circuit.
2. After servicing, see to it that all the protective devices
such as insulation barriers, insulation papers shields are
properly installed.
3. After servicing, make the following leakage current
checks to prevent the customer from being exposed to
shock hazards.
LEAKAGE CURRENT COLD CHECK
1. Unplug the AC cord and connect a jumper between the
two prongs on the plug.
2. Measure the resistance value, with an ohm meter,
between the jumpered AC plug and each exposed
metallic cabinet part on the equipment such as
screwheads, connectors, control shafts, etc. The
resistance value must be more than 5M
:
.
Figure1
LEAKAGE CURRENT HOT CHECK (See Figure 1)
1. Plug the AC cord directly into the AC outlet.
Do not use an isolation transformer for this check.
2. Connect a 1.5K
:
, 10W resistor, in parallel with a 0.15
P
F
capacitor, between each exposed metallic part on the set
an a good earth ground such as a water pipe, as shown
in Figure1.
3. Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4. Check each exposed metallic part, and measure the
voltage at each point.
5. Reverse the AC plug in the AC outlet repeat each of the
above measurements.
6. The potential at any point should not exceed 0.15 volts
RMS. A leakage current tester (Simpson Model 229
equivalent) may be used to make the hot checks,
leakage current must not exceed 0.1 milliamp. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should
be repaired and rechecked before it is returned to the
customer.
ELECTROSTATICALLY SENSITIVE (ES) DEVICES
Some semiconductor (solid state) devices can be damaged
easily by static electricity. Such components commonly are
called Electrostatically sensitive (ED) Devices. Examples of
typical ES devices are integrated circuits and some field-
effect transistors and semiconductor “chip” components.
The following techniques should be used to help reduce the
incidence of component damage caused by static electricity.
1. Immediately before handling any semiconductor
component or semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a
known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist trap device, which should be removed
for potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface
such as alminum foil, to prevent electrostatic charge
buildup or exposure of the assembly.
3. Use only a grounded tip soldering iron to solder or
unsolder ES devices.
4. Use only an anti-static solder removal device classified
as “anti-static” can generate electrical charges sufficient
to damage ES devices.
5. Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its
protective package until immediately before you are
ready to install it.
(most replacement ES devices are package with leads
electrically shorted together by conductive foam,
alminum foil or comparable conductive material).
7. Immediately before removing the protective material
from the leads of a replacement ES device, touch the
protective material to the chassis or circuit assembly into
which the device will be installed.
CAUTION : Be sure no power is applied to the chassis or
circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise hamless motion
such as the brushing together of your clothes fabric or
the lifting of your foot from a carpeted floor can generate
static electricity sufficient to damage an ES device).
X-RADIATION
WARNING
1. The potential source of X-radiation in EVF sets is the
High Voltage section and the picture tube.
2. When using a picture tube test jig for service, ensure that
jig is capable of handling 10kV without causing X-
Radiation.
Note :
It is important to use an accurate periodically
calibrated high voltage meter.
3. Measure the High Voltage. The meter (electric type)
reading should indicate 2.5kV,±0.15kV. If the meter
indication is out of tolerance, immediate service and
correction is required to prevent the possibility of
premature component failure. To prevent an X-Radiation
possibility, it is essential to use the specified picture tube.
SAFETY PRECAUTIONS
Summary of Contents for AJ-D455P
Page 3: ...3 AJ YA455P AJ YAD455P...
Page 5: ...5...
Page 9: ...CBA 20 MECHA IF2 P C BOARD VEP82240A COMPONENT SIDE FOIL SIDE...
Page 12: ...CBA 23 AV JACK P C BOARD VEP80C13B COMPONENT SIDE COMPONENT SIDE REF LOC P1 E5 P2 A2 P100 F1...
Page 97: ...ELE 40 COMPONENT SIDE F5 V IN P C BOARD VEP83553A F6 SYSCON P C BOARD VEP86314A COMPONENT SIDE...
Page 98: ...ELE 41 F7 SERVO P C BOARD VEP82238A COMPONENT SIDE F8 RF EQ P C BOARD VEP85196A COMPONENT SIDE...
Page 99: ...ELE 42 MECHA IF P C BOARD VEP82239A COMPONENT SIDE RF CUE P C BOARD VEP85197A COMPONENT SIDE...
Page 100: ...ELE 43 CSP SUB P C BOARD VEP83555A FOIL SIDE...
Page 102: ...PRT 2 MECHANICAL CHASSIS ASSEMBLY 1...
Page 104: ...PRT 4 MECHANICAL CHASSIS ASSEMBLY 2...
Page 106: ...PRT 6 SUB CHASSIS ASSEMBLY...
Page 108: ...PRT 8 CASSETTE COMPARTMENT ASSEMBLY...
Page 110: ...PRT 10 CASING PARTS ASSEMBLY...
Page 112: ...PRT 12 FRONT PANEL ASSEMBLY...
Page 114: ...PRT 14 CHASSIS FRAME ASSEMBLY...
Page 116: ...PRT 16 REAR PANEL ASSEMBLY...
Page 118: ...PRT 18 PACKING PARTS ASSEMBLY...
Page 120: ...PRT 20 PACKING PARTS ASSEMBLY AJ YA455P...
Page 122: ...PRT 22 PACKING PARTS ASSEMBLY AJ YAD455P...
Page 124: ...PRT 24 PACKING PARTS ASSEMBLY AJ CS455P...
Page 168: ...INF 43 15 Circuit board layout drawing...
Page 377: ...INF 43 15 Circuit board layout drawing...
Page 431: ...ELE 40 COMPONENT SIDE F5 V IN P C BOARD VEP83553A F6 SYSCON P C BOARD VEP86314A COMPONENT SIDE...
Page 432: ...ELE 41 F7 SERVO P C BOARD VEP82238A COMPONENT SIDE F8 RF EQ P C BOARD VEP85196A COMPONENT SIDE...
Page 433: ...ELE 42 MECHA IF P C BOARD VEP82239A COMPONENT SIDE RF CUE P C BOARD VEP85197A COMPONENT SIDE...
Page 434: ...ELE 43 CSP SUB P C BOARD VEP83555A FOIL SIDE...
Page 436: ...BLK 1 OVERALL BLOCK DIAGRAM 1 2...
Page 437: ...BLK 2 OVERALL BLOCK DIAGRAM 2 2...
Page 438: ...BLK 3 F1 AUDIO BLOCK DIAGRAM 1 2...
Page 439: ...BLK 4 F1 AUDIO BLOCK DIAGRAM 2 2...
Page 440: ...BLK 5 F2 VIDEO OUT BLOCK DIAGRAM 1 2...
Page 441: ...BLK 6 F2 VIDEO OUT BLOCK DIAGRAM 2 2...
Page 442: ...BLK 7 F4 D PROCESS BLOCK DIAGRAM 1 5...
Page 443: ...BLK 8 F4 D PROCESS BLOCK DIAGRAM 2 5...
Page 444: ...BLK 9 F4 D PROCESS BLOCK DIAGRAM 3 5...
Page 445: ...BLK 10 F4 D PROCESS BLOCK DIAGRAM 4 5...
Page 446: ...BLK 11 F4 D PROCESS BLOCK DIAGRAM 5 5...
Page 447: ...BLK 12 F5 VIDEO IN BLOCK DIAGRAM 1 2...
Page 448: ...BLK 13 F5 VIDEO IN BLOCK DIAGRAM 2 2...
Page 449: ...BLK 14 F6 SYSCON BLOCK DIAGRAM 1 2...
Page 450: ...BLK 15 F6 SYSCON BLOCK DIAGRAM 2 2...
Page 451: ...BLK 16 FRONT BLOCK DIAGRAM...
Page 452: ...BLK 17 F7 SERVO BLOCK DIAGRAM 1 2...
Page 453: ...BLK 18 F7 SERVO BLOCK DIAGRAM 2 2...
Page 454: ...BLK 19 RF CUE BLOCK DIAGRAM...
Page 455: ...BLK 20 F8 RF EQ BLOCK DIAGRAM...
Page 456: ...BLK 21 F3A SDI BLOCK DIAGRAM 1 2 AJ YA455P...
Page 457: ...BLK 22 F3A SDI BLOCK DIAGRAM 2 2 AJ YA455P...
Page 458: ...DIF JACK C B A BLK 23 F3B DIF BLOCK DIAGRAM 1 2 AJ YAD455P...
Page 459: ...BLK 24 F3B DIF BLOCK DIAGRAM 2 2 AJ YAD455P...
Page 640: ...CBA 20 MECHA IF2 P C BOARD VEP82240A COMPONENT SIDE FOIL SIDE...
Page 651: ...PRT 2 MECHANICAL CHASSIS ASSEMBLY 1...
Page 653: ...PRT 4 MECHANICAL CHASSIS ASSEMBLY 2...
Page 655: ...PRT 6 SUB CHASSIS ASSEMBLY...
Page 657: ...PRT 8 CASSETTE COMPARTMENT ASSEMBLY...
Page 659: ...PRT 10 CASING PARTS ASSEMBLY...
Page 661: ...PRT 12 FRONT PANEL ASSEMBLY...
Page 663: ...PRT 14 CHASSIS FRAME ASSEMBLY...
Page 665: ...PRT 16 REAR PANEL ASSEMBLY...
Page 667: ...PRT 18 PACKING PARTS ASSEMBLY...
Page 669: ...PRT 20 PACKING PARTS ASSEMBLY AJ YA455P...
Page 671: ...PRT 22 PACKING PARTS ASSEMBLY AJ YAD455P...
Page 673: ...PRT 24 PACKING PARTS ASSEMBLY AJ CS455P...
Page 712: ...Printed in Japan FCD0105NCKK80 E362 E363...
Page 713: ...OVERALL BLOCK DIAGRAM...
Page 714: ...F1 AUDIO BLOCK DIAGRAM...
Page 715: ...F2 VIDEO OUT BLOCK DIAGRAM...
Page 716: ...F4 D PROCESS BLOCK DIAGRAM 1 3...
Page 717: ...F4 D PROCESS BLOCK DIAGRAM 2 3...
Page 718: ...F4 D PROCESS BLOCK DIAGRAM PB BLOCK DIAGRAM 3 3...
Page 719: ...F5 VIDEO IN BLOCK DIAGRAM...
Page 720: ...F6 SYSCON BLOCK DIAGRAM 1 2...
Page 721: ...F6 SYSCON BLOCK DIAGRAM 2 2...
Page 722: ...FRONT BLOCK DIAGRAM...
Page 723: ...F7 SERVO BLOCK DIAGRAM...
Page 724: ...RF CUE BLOCK DIAGRAM...
Page 725: ...F8 RF EQ BLOCK DIAGRAM...
Page 726: ...F3A SDI BLOCK DIAGRAM AJ YA455P...
Page 727: ...DIF JACK C B A F3B DIF BLOCK DIAGRAM AJ YAD455P...