SX-70
10
Thru-Hole Solder Extraction
1. Ensure that the air hose is connected to a VisiFilter and the Vacuum Port
on the power source. Select an operating temperature that will cause
complete solder melt in 2-5 seconds (somewhat longer on heavy
multilayer boards). A tip temperature of 316°C (600°F) is recommended
for most applications.
2. Position your index finger on the handpiece vacuum control switch.
3. Gently position the extractor tip over the lead contacting the solidified
solder keeping tip perpendicular to the pad and board.
NOTE -
Do not apply pressure against the pad at any time during this
operation. Damage to the board may result.
4. Gently move the lead ...
a) in a circular motion for round
leads
b) in a back and forth motion
for flat leads
until the lead moves freely.
Free lead movement indicates
that complete solder melt has
been obtained.
5. While continuing to move lead, actuate vacuum with the finger switch
and keep on for at least 2 seconds to cool joint and prevent resweating.
The length of time from when heat is applied until the time vacuum is
started (i.e., complete solder melt) should be 2-5 seconds under normal
conditions. Heavy multilayer boards may require somewhat longer
heating times. In extreme cases, preheating or auxiliary heating is
recommended to achieve the safest results.
NOTE
Premature actuation of the vacuum may result in incomplete removal of solder
from the joint being desoldered. Free movement of the lead is the workpiece
indicator that proper solder melt has been achieved. In the event that all the
solder has not been removed from the hole, resolder the hole and try again
after the board has been allowed to cool.
