SX-70
11
6. Remove tip from pad and continue vacuum application for an additional 2
seconds to insure that all residual solder is drawn into the solder
collection chamber.
7. Retin tip using large gauge flux cored solder and return SX-70 to its Tip
& Tool Stand.
8. After all leads are desoldered, the component is easily removed. If any
solder should remain in the plated thru-hole after extraction, resolder the
connection and perform this procedure again.
Tip Cleaning
During heavy, continuous desoldering, on boards with flux residues or other
contamination, the tip may occasionally become clogged with such material. If
this should occur, clean the tip with the Tip Cleaning Kit (PACE part number
6993-0200) by inserting the wire tool into the tip end.
Special Applications
If you require assistance in the use of this handpiece or with a special application,
contact PACE Applications Support at:
Telephone:
1-888-535-7223 (toll-free) or (301) 490 - 9860
Fax:
(301) 604 - 8782
Surface Mount Component Removal
TQFP and TSOP surface mount components can be removed using the SX-70
handpiece and the appropriate Pik-Tip. Old or excess solder can be removed from
surface mount lands using PACE Flo-D-Sodr tips.
PACE recommends the use of the Manual Assembly and Rework For Surface Mount
manual (P/N 6031-2107) as a guide for developing repair/rework procedures for
your particular applications.
