Measuring warp
and inclination
Integrated calculation
functions can be used for
P-P or A-B calculation.
Measuring parts height
during clock assembly
The sensor head can be
placed in direct contact
with the measurement
object, so that height
differences – no matter
how small – can
be confirmed.
Diameter and eccentricity
measurement
Measuring the diameter
and eccentricity of valves
and shafts with a high
resolution of 0.1
µ
m can
be performed without
any influence from
surface conditions.
Measuring precision
tooling of engine block
Up to 8 sensor units
can be connected for
addition and subtraction
measurements, to give the
most even calculation
result possible.
Measuring warp in HDD
chassis assembly
Up to 8 sensor heads can
be combined in one appli-
cation, and thanks to the
small size of the sensor
head (6mm diameter)
it is possible to integrate
it into narrow space
applications like warp and
HDD chassis assembly.
Semiconductor industry –
wafer pre-alignment
process
The ZX-T is ideal for
checking the evenness
(flatness) or inclination
of a wafer before the
next process.
