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NXP Semiconductors
JN-RM-2080
K32W module development reference manual
JN-RM-2080
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© NXP Semiconductors N.V. 2020. All rights reserved.
Reference manual
Rev. 1.0
— 27 Mar 2020
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• Die flag shape
4.2 PCB Stack-Up
Complexity is the main factor that will determine whether the design of an application
board can be two-layer, four-layer, or more. From an RF point of view a 4 layers PCB
is preferred to a two layers PCB. Nevertheless, in a very simple application it should
be possible to use a 2 layers PCB.
The recommended board stack-up for either a four-layer or two-layer board design is
as follows:
•
4-layer stack-up:
—
Top: RF routing of transmission lines
—
L2: RF reference ground
—
L3: DC power
—
Bottom: signal routing
•
Two-layer stack-up:
—
Top: RF routing of transmission lines, signals, and ground
—
Bottom: RF reference ground, signal routing, and general ground
The K32W061-001-M10 and K32W061-001-M13 (OM15069) and K32W061-001-M16
(OM15062) modules are built on a standard 4
–layer printed circuit board (PCB) with the
individual layers organized as shown in
Fig 6.
PCB stack-up
Note
: The NXP PCB layouts assume use of the layers defined above. If a different PCB
stack-up is used, then NXP does not guarantee performance.
NXP strongly recommends the use of the above stack-up.
, regarding transmission lines, it is important to copy not just the
physical layout of the circuit, but also the PCB stack-up. Any small change in the
