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NXP Semiconductors
JN-RM-2080
K32W module development reference manual
JN-RM-2080
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© NXP Semiconductors N.V. 2020. All rights reserved.
Reference manual
Rev. 1.0
— 27 Mar 2020
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Fig 8.
RF Plots for 3pF ceramic capacitor Murata GRM1555 type
The same is true of inductors. There is parasitic capacitance in an inductor, mainly due
to capacitive coupling between the turns of wire. At some point in frequency, this
capacitance will have a higher impedance than the inductance of the part. From this
frequency and higher the part acts as a capacitor and not as an inductor.
The Bill of Materials (BOM) is available for all NXP reference designs. The BOM
shows the specific vendors and part numbers used on NXP designs. It is certainly
possible to substitute another vendor's parts, but it may impact the performance of the
circuit, therefore, it may be necessary to use different component values when parts
from another vendor are used.
If there is a performance issue on a new design, and part substitutions were made on
that design, then it is strongly recommended that components identical to those used
in the NXP reference design be placed on the new design for test purposes. Once the
design is working properly with components that are identical to those used by NXP,
then it will be possible to substitute components from other vendors one at a time, and
test for any impact on circuit performance.
4.6 GND planes
I
t is recommended to use a solid (continuous) ground plane on Layer 2, assuming Layer
1 (top) is used for the RF components and transmission lines; avoid cut-outs or slots in
that area.
Keep top ground continuous as possible. This also applies for the other layers.
Connect ground on the components layer to the ground plane beneath with a large
quantity of vias.
