N1_Hardware_User_Guide
Copyright © Neoway Technology Co., Ltd
61
11 Mounting and Packaging
11.1 Mounting the Module onto the Application Board
N1 is compatible with industrial standard reflow profile for lead-free SMT process.
The reflow profile is process dependent, so the following recommendation is just a start point guideline:
Only one flow is supported.
Quality of the solder joint depends on the solder volume. The stencil thickness of0.15 mm to 0.20
mm is recommended.
Use bigger aperture size of the stencil than actual pad size.
Use a low-residue, no-clean type solder paste.
N1 is big and use multi-layer HDI board so that it is difficult to solder. For information about cautions in
N1 storage and mounting, refer to
Neoway Module Reflow Manufacturing Recommendations
.
When maintaining and manually desoldering it, use heat guns with great opening, adjust the temperature
depending on the solder paste type (330°C for solder paste without lead; 300°C for solder past with lead),
and heat the module till the solder paste is melt. Then remove the module using tweezers. Do not shake
the module in high temperature while removing it. Otherwise, the components inside the module might
get misplaced.
11.2 Packaging
N1 modules are packaged in sealed bags on delivery to guarantee a long shelf life. Package the modules
again in case of opened for any reasons.
Storage environment: the temperature is lower than 40°C and the humidity is lower than 90%.
If the modules are exposed to air for more than 48 hours at conditions not worse than 30°C/60% RH, a
baking procedure should be done before SMT. Or, if the indication card shows humidity greater than 20%,
the baking procedure is also required. The recommended baking conditions are 90°C/12 hours. Do not
bake modules with the package tray directly.
There are 12 pieces on each tray, 10 trays in each sealing bag, and 4 bags in each box.
