Figure 11.
Onboard Temperature-Monitoring Sensors
2
1
3
1. CPU/FPGA sensor
2. Primary System sensor
3. Secondary System sensor
•
CPU/FPGA sensor—Digitally reports the die junction temperature of the Xilinx Zynq
SoC.
•
Primary System sensor—Digitally reports the temperature on the Xilinx Zynq SoC side
of the circuit card assembly. This value is a conservative approximation of the local
ambient temperature on that side of the circuit card assembly.
•
Secondary System sensor—Digitally reports the temperature on the SEARAY side of the
circuit card assembly. This value is a conservative approximation of the local ambient
temperature on that side of the circuit card assembly.
In addition to being useful for system validation, digitally reported temperatures also provide
feedback about system health and can be used as triggers or set points.
NI recommends that you monitor the digitally reported temperatures on deployed systems,
especially if the temperatures approach the maximum thermal specifications during system
validation testing. Monitoring allows individual systems to identify adverse thermal changes
caused by differences in environmental, operating, or process conditions.
For more information about how to access and use the digitally reported temperature sensor
measurements, visit
sbriosensors
.
Managing Power and Feature Utilization
An NI sbRIO device that heavily utilizes all of its performance and features consumes and
dissipates substantially more power than an idle device.
NI sbRIO-9607 User Manual
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© National Instruments
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