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Murata Electronics Oy
Assembly Instructions for Murata's SCC1000 series
TN82
www.murata.com
Rev. 2.0
5.6 Reflow soldering
A forced convection reflow oven is recommended to be used for soldering DIL components. IR-
based reflow ovens are not generally suitable for lead-free soldering. Figure 7 presents a general
forced convection reflow solder profile and it also shows the typical phases of a reflow process.
The reflow profile used for soldering the DIL package should always follow the solder paste
manufacturer's specifications and recommended profile.
If washing process is done after the
soldering process, it must be noted that ultrasonic agitation wash after reflow is not allowed
for Murata's DIL packaged MEMS components.
As mentioned before (section 5.2) a no-clean
paste is recommended.
Table 2. Classification reflow profiles according to IPC/JEDEC J-STD-020D
Profile feature
Sn-Pb Eutectic Assembly
Pb-free Assembly
Preheat
-
Temperature min (T
smin
)
-
Temperature max (T
smax
)
-
Time (min to max) (t
s
)
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-180 seconds
Average ramp-up rate (T
smax
to T
p
)
3°C/second max
3°C/second max
Liquidous temperature (T
L
)
Time at liquidous (t
L
)
183 °C
60-150 seconds
217 °C
60-150 seconds
Classification temperature (T
c
)
220 °C
245 °C
Peak package body temperature (T
P
)*
220 °C
245 °C
Time (t
c
)** within 5 °C of the specified
classification temperature (T
c
)
20** seconds
30** seconds
Average ramp-down rate (T
p
to T
smax
)
6 °C/second max
6 °C/second max
Time 25 °C to Peak temperature
6 minutes max
8 minutes max
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Figure 7. Typical convection reflow soldering phases and profile. IPC/JEDEC J-STD-020D.
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