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Murata Electronics Oy
Assembly Instructions for Murata's SCC1000 series
TN82
www.murata.com
Rev. 2.0
Figure 9. Using tin wire and soldering iron for hand soldering. Picture for reference only.
6.2 METHOD B: Soldering by applying solder paste and then using reflow heating or
soldering iron
1. Apply the solder paste onto the PCB land pads. The paste can be applied by two different
methods.
-
Manual solder paste printing through a stencil with normal openings designed for the
DIL component.
-
Needle dispensing of solder paste manually onto the PCB pads. Murata recommends
use of a microscope in manual solder paste dispensing. Dispensing needle tip size can
be 0.12"-0.16".
2. Place the component gently on top of the solder paste. To avoid solder bridging, push only very
gently on top of the component.
3.
i)
Melt the solder paste by putting the part through reflow oven
or
ii)
by using soldering iron as
mentioned in the previous part.
7
Rework Guidelines
If it becomes necessary to rework a SCC1000 series component, the preferred way to remove the
component is by hot air. Use of a hot air rework station with a vacuum chuck, is the preferred
method. A key issue in using hot-air is preventing thermal damage to the component or adjacent
components.
If hot air rework station is not available, rework with thermal tweezers is also an acceptable
alternative
Removing of the component with hot iron only is difficult as it is easy to get the part too hot and
destroy it. It is not recommend method if failure analysis or re-use of the component is desired.
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SCC1xx0_1640-21648-0004-E-0519
