Murata SCC1000 Series Assembly Instructions Manual Download Page 13

 

 

 

 

 

 

 

 

 

 

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Murata Electronics Oy 

Assembly Instructions for Murata's SCC1000 series 

TN82  

www.murata.com 

 

Rev. 2.0 

 

 

5.9.5  Vacuum level 

Vacuum  levels  lower  than  0.4  bar  shall  not  be  applied  on  sensor  component.  Fast  pressure 
changes of over 0.5 bar/min should be avoided. 
 

5.9.6  Air blowing 

Heavy compressed air blowing directly onto sensor component shall be avoided. 
 

5.9.7  ESD 

Sensor  components  are  electrical  devices.  Sensor  components  should  be  handled  under  good 
ESD  practices  and  ESD  discharges  should  be  avoided.  The  following  numbers  are  absolute 
maximum ratings: 
 

 

±500 V charged device model 

 

±2 kV human body model 

 

5.9.8  Moisture 

Sensor  components  are  moisture  sensitive  devices,  classified  as  MSL3  level.  Guidelines  defined 
by IPC/JEDEC J-STD-020D shall be followed. 
 
 

Hand Soldering Guidelines 

For hand soldering of the DIL component, Murata recommends eutectic tin-lead solder due to the 
lower melting point compared to lead-free solders. Key thing is that as soon as the solder flows the 
soldering  iron  must  be  removed  from  the  board.  The  package  maximum  temperature  should  be 
kept under 245ºC and all mechanical stresses in the pin should be minimized. It should be noted, 
that also PCB material might damage if too much heat or force is used.  
 
Generally the hand soldering of the DIL component can be done in two different ways:  
 

Method A

: Soldering of components with tin wire and soldering iron  

 

Method B

: Soldering by applying solder paste onto PCB land pads and 

then

 using reflow heating 

or soldering iron to melt the paste and achieve the soldered joint. 
 

 

6.1  METHOD A: Soldering of components with soldering iron 

 

Use the tin  wire and soldering iron to solder the component onto PCB. Do not touch the package 
plastic body with the soldering iron, soldering iron should touch only the PCB pad and through that 
the heat should be conducted to the tin wire and component lead. Murata has used 315ºC setting 
temperature  for  component  soldering.  The  temperature  on  the  tip  of  the  tool  is  270...275ºC. 
Soldering  process  takes  only  few  seconds  for  each  pin.  For  leaded  soldering  we  have  used 
Multicore Sn60Pb40 and for lead-free soldering Almit KR-19SHrma flux-cored solder wire. 

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SCC1xx0_1640-21648-0004-E-0519

Summary of Contents for SCC1000 Series

Page 1: ...1 17 Murata Electronics Oy Assembly Instructions for Murata s SCC1000 series TN82 www murata com Rev 2 0 ASSEMBLY INSTRUCTIONS FOR SCC1000 SERIES Technical Note 82 1 SCC1xx0_1640 21648 0004 E 0519...

Page 2: ...ent picking and placement 8 5 6 Reflow soldering 9 5 7 Moisture sensitivity level MSL classification 10 5 8 Inspection 10 5 9 Precautions 12 5 9 1 Mechanical shocks 12 5 9 2 Vibration 12 5 9 3 Chemica...

Page 3: ...ulfill the needs of varying end use applications 2 Murata s 32 lead Dual In line Package DIL 32 The SCC1000 series products are SMD DIL 32 components pick and place mountable and reflow solderable The...

Page 4: ...3 DIL 32 Package Outline and Dimensions The outline and dimensions for the DIL 32 package are presented in Figure 2 Figure 2 Outline and dimensions for DIL 32 package Dimensions are in millimeters mm...

Page 5: ...mensions are presented in Figure 3 The unreeling direction and component polarity on tape are presented in Figure 4 Figure 3 Packing tape dimensions for the DIL 32 Package Dimensions are in millimeter...

Page 6: ...com Rev 2 0 The reel dimensions are presented in Figure 5 and Table 1 below Dimensions are in millimeters mm Figure 5 Reel dimensions All dimensions are in millimeters mm Table 1 Packing reel dimensi...

Page 7: ...d with lead free SAC tin silver copper solder The SAC solder paste composition should be near eutectic The melting point of lead free SAC solder can vary between 217 221 C depending on the composition...

Page 8: ...ecting any of these can cause open solder joints bridging solder balling or other unwanted soldering results 5 5 Component picking and placement The DIL package can be picked from the carrier tape usi...

Page 9: ...sification reflow profiles according to IPC JEDEC J STD 020D Profile feature Sn Pb Eutectic Assembly Pb free Assembly Preheat Temperature min Tsmin Temperature max Tsmax Time min to max ts 100 C 150 C...

Page 10: ...ined in Table 2 Following instruction shall be followed 1 Calculated shelf life in sealed bag 12 months at 40 C and 90 relative humidity RH 2 Maximum soldering peak temperature for the package is defi...

Page 11: ...lectronics Oy Assembly Instructions for Murata s SCC1000 series TN82 www murata com Rev 2 0 Figure 8 Cross section of the DIL package lead s solder joint with eutectic SnPb solder 11 SCC1xx0_1640 2164...

Page 12: ...both prior to or during assembly Many assembly processes can induce vibration typical ones being PCB singulation mechanical shocks transportation friction welding and ultra sonic cleaning Reference t...

Page 13: ...must be removed from the board The package maximum temperature should be kept under 245 C and all mechanical stresses in the pin should be minimized It should be noted that also PCB material might da...

Page 14: ...nt gently on top of the solder paste To avoid solder bridging push only very gently on top of the component 3 i Melt the solder paste by putting the part through reflow oven or ii by using soldering i...

Page 15: ...280 C If the pins are heated too long the plastic around pin will be softened and if there at the same time is some stress on the pin there is a risk that pin might move and cause increased reliabilit...

Page 16: ...ely after solder melting component is lifted Remove the solder from the PCB using either a solder vacuum or solder braid making sure to clean the area of solder thoroughly Figure 14 Soldering iron and...

Page 17: ...ould be soldered with lead free solders in order to guarantee full RoHS compatibility 9 References JEDEC Electronic Industries Alliance Inc Moisture Reflow Sensitivity Classification for Non Hermetic...

Page 18: ...for you Addresses and Contacts Headquarter Switzerland Angst Pfister Sensors and Power AG Thurgauerstrasse 66 CH 8050 Zurich Phone 41 44 877 35 00 sensorsandpower angst pfister com Office Germany Ang...

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