background image

Package

LLA Type

 

 

Chip 

2.0

±

0.5 

φ 21

±

0.8 

φ

1

8

0

+0

/-

3

.0

 

φ

330

±

2

.0

 

φ

5

0

 mi

n

φ

13

±

0

.5

 

10

±

1.5 

16.5 max. 

Hole for Chip : As specified in 2.2 

Base Tape : As specified in 2.2 

Top Tape : Thickness 0.06 

(*LLA18 /LLA215/LLA315 type: Thickness 0.05) 

 

 

Feeding Hole : As specified in 2.2 

Fig 1    Package Chip 

Fig.2    Dimension of Reel 

Fig3    Taping Diagram 

(in mm) 

 

JEMCAP-00644A

5

Summary of Contents for LLA185C70G105ME01 Series

Page 1: ...General Electronic equipment 20 55 to 125 C 22 to 22 55 to 125 C 25 C 3 Temperature Characteristics Public STD Code F EIA p Specifications and Test Methods Operationg Temp Range Temp coeff or Cap Cha...

Page 2: ...a Termination should occur eutectic solder Then apply 5N force in parallel with the test jig for 10 1 sec The soldering shall be done either with an iron or using the reflow method and shall be conduc...

Page 3: ...at 150 0 10 C for one houg and then let sit D F 0 2 max for 24 2 hours at room temperature Perform the initial measurement I R 12 5 F min Measurement after test Perform a heat treatment at 150 0 10 fo...

Page 4: ...g Code L K 2 1 Minimum Quantity pcs reel 2 2 Dimensions of Tape in mm Package LLA Type 4 0 0 1 4 0 0 1 2 0 0 1 0 2 0 1 1 7max A B 1 75 0 1 3 5 0 05 8 0 0 3 1 5 Code LLA18 LLA21 LLA31 A 1 05 0 1 1 45 0...

Page 5: ...0 5 10 1 5 16 5 max Hole for Chip As specified in 2 2 Base Tape As specified in 2 2 Top Tape Thickness 0 06 LLA18 LLA215 LLA315 type Thickness 0 05 Feeding Hole As specified in 2 2 Fig 1 Package Chip...

Page 6: ...no jointing for top tape and bottom tape 2 9 There are no fuzz in the cavity 2 10 Break down force of top tape 5N min 2 11 Reel is made by resin and appeaser and dimension is shown in Fig 3 There are...

Page 7: ...ght dust rapid temperature changes corrosive gas atmosphere or high temperature and humidity conditions during storage may affect the solderability and the packaging performance Please use product wit...

Page 8: ...itors using your actual appliances at the intended environment and operating conditions Typical temperature characteristics Char R6 X5R Typical temperature characteristics Char R7 X7R Typical temperat...

Page 9: ...Pulse voltage E Maximum possible applied voltage 1 2 Influence of overvoltage Overvoltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown of the inte...

Page 10: ...s such as their aging voltage and temperature characteristics And check capacitors using your actual appliances at the intended environment and operating conditions 2 The capacitance values of high di...

Page 11: ...ny impact on the terminals 2 Mechanical shock due to falling may cause damage or a crack in the dielectric material of the capacitor Do not use a fallen capacitor because the quality and reliability m...

Page 12: ...use capacitors that were removed from the equipment 2 Confirm capacitance characteristics under actual applied voltage 3 Confirm the mechanical stress under actual process and equipment use 4 Confirm...

Page 13: ...nozzle so as not to bend the printed circuit board 2 Adjust the nozzle pressure within a static load of 1N to 3N during mounting Incorrect Correct 2 Dirt particles and dust accumulated between the suc...

Page 14: ...flow Vapor Reflow Peak Temperature 230 250 230 240 240 260 Atmosphere Air Air Air or N2 Pb Sn Solder Sn 37Pb Lead Free Solder Sn 3 0Ag 0 5Cu 4 Optimum Solder Amount for Reflow Soldering 4 1 Overly thi...

Page 15: ...rmance of a capacitor after mounting on the printed circuit board 1 1 Avoid bending printed circuit board by the pressure of a test pin etc The thrusting force of the test probe can flex the PCB resul...

Page 16: ...ig and from the front side of board as below the capacitor may form a crack caused by the tensile stress applied to capacitor Outline of jig 2 Example of a suitable machine An outline of a printed cir...

Page 17: ...hat can cause condensation 2 Others 2 1 In an Emergency 1 If the equipment should generate smoke fire or smell immediately turn off or unplug the equipment If the equipment is not turned off or unplug...

Page 18: ...capacitors 1 1 The capacitor when used in the above unsuitable operating environments may deteriorate due to the corrosion of the terminations and the penetration of moisture into the capacitor 1 2 Th...

Page 19: ...and dimensions into consideration to eliminate the possibility of excess solder fillet height 1 2 It is possible for the chip to crack by the expansion and shrinkage of a metal board Please contact us...

Page 20: ...ons in table 1 for flow soldering table 2 for reflow soldering Please confirm the suitable land dimension by evaluating of the actual SET PCB Table 2 Reflow Soldering Method Dimensions Part Number in...

Page 21: ...ocess The stress is affected by the amount of resin and curing contraction Select a resin with small curing contraction The difference in the thermal expansion coefficient between a coating resin or a...

Page 22: ...way that the boxes are not deformed and forces are not directly passed on to the inner packaging 1 2 Do not apply excessive vibration shock and pressure to the capacitor 1 When excessive mechanical sh...

Page 23: ...ation 3 We consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications drawings or other technical documents Therefore if your...

Page 24: ...GJ2D051515SC 82224C 82473C GCJ31CR71H105KA12L GRM2165C1H101FA01D GRM55D7U3A103JW31L PTGL09AS2R2K3B51B0 11R683C 1217AS H 1R5N P3 DD1274AS H 220M P3 1447440C BPM15 120 Q12P C NMK1212SC NMV1212DAC NXFT15...

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