Notice
2. Land Dimensions
2-1. Please refer to the land dimensions in table 1 for flow
soldering, table 2 for reflow soldering, table 3 for
reflow soldering for ZRB Series, table 4 for reflow
soldering for LLA Series, table 5 for reflow soldering
for LLM Series.
Please confirm the suitable land dimension by
evaluating of the actual SET / PCB.
GQM/GR3/GRJ/GRM
GQM/GR3/GRJ/GRM
GR3/GRJ/GRM
LLL
LLL
1.6
g
0.8
2.0
g
1.25
3.2
g
1.6
1.25
g
2.0
1.6
g
3.2
0.6 to 1.0
1.0 to 1.2
2.2 to 2.6
0.4 to 0.7
0.6 to 1.0
0.8 to 0.9
0.9 to 1.0
1.0 to 1.1
0.5 to 0.7
0.8 to 0.9
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4
1.4 to 1.8
2.6 to 2.8
(in mm)
Chip (L
g
W)
a
b
c
Table 1 Flow Soldering Method
Series
18
21
31
21
31
Chip Dimension Code
(L/W)
Flow soldering can only be used for products with a chip size from 1.6x0.8mm to 3.2x1.6mm.
Solder Resist
a
b
c
Chip Capacitor
Land
Continued from the preceding page.
Continued on the following page.
Chassis
Solder (ground)
Electrode Pattern
Solder Resist
Solder Resist
Solder Resist
Lead Wire
Soldering Iron
Lead Wire
Solder Resist
Pattern Forms
Placing Close to Chassis
Placing
of Chip Components
and Leaded Components
Placing
of Leaded Components
after Chip Component
Lateral Mounting
Prohibited
Correct
in section
in section
in section
in section
in section
in section
!
Note
• Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
