!
Caution
3-2. A soldering iron with a tip of ø3mm or smaller should
be used. It is also necessary to keep the soldering iron
from touching the components during the re-work.
3-3. Solder wire with ø0.5mm or smaller is required for
soldering.
<Applicable to KR3/KRM Series>
4. For the shape of the soldering iron tip, refer to the figure
on the right.
Regarding the type of solder, use a wire diameter of
ø0.5mm or less (rosin core wire solder).
4-1. How to Apply the Soldering Iron
Apply the tip of the soldering iron against the lower
end of the metal terminal.
1) In order to prevent cracking caused by sudden
heating of the ceramic device, do not touch the
ceramic base directly.
2) In order to prevent deviations and dislocating of
the chip, do not touch the junction of the chip and
the metal terminal, and the metal portion on the
outside directly.
4-2. Appropriate Amount of Solder
The amount of solder for corrections by soldering iron,
should be lower than the height of the lower side of
the chip.
Cross Section
17
26
(in mm)
R0.5
ø6.5
Apply the tip of the soldering iron only
on the terminal portion, without touching
the body of the chip.
Tip of Soldering Iron
Tip temperature: 350°C or less/
5 sec. or less/60W or less
Copper Land
Wire Solder
6. Electrical Test on Printed Circuit Board
1. Confirm position of the support pin or specific jig, when
inspecting the electrical performance of a capacitor after
mounting on the printed circuit board.
1-1. Avoid bending the printed circuit board by the
pressure of a test-probe, etc.
The thrusting force of the test probe can flex the
PCB, resulting in cracked chips or open solder joints.
Provide support pins on the back side of the PCB to
prevent warping or flexing. Install support pins as
close to the test-probe as possible.
1-2. Avoid vibration of the board by shock when a
test-probe contacts a printed circuit board.
7. Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do
not apply any stress to the capacitor that causes bending
or twisting the board.
1-1. In cropping the board, the stress as shown at right
may cause the capacitor to crack.
Cracked capacitors may cause deterioration of the
insulation resistance, and result in a short.
Avoid this type of stress to a capacitor.
[Not Recommended]
[Recommended]
Peeling
Test-probe
Support Pin
Test-probe
[Bending]
[Twisting]
5. Washing
Excessive ultrasonic oscillation during cleaning can cause
the PCBs to resonate, resulting in cracked chips or broken
solder joints. Before starting your production process, test
your cleaning equipment/process to insure it does not
degrade the capacitors.
Continued from the preceding page.
Continued on the following page.
!
Note
• Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
