!
Caution
2. Check the cropping method for the printed circuit board
in advance.
2-1. Printed circuit board cropping shall be carried out by
using a jig or an apparatus (Disc separator, router
type separator, etc.) to prevent the mechanical
stress that can occur to the board.
Level of stress on board
Board Separation Method
High
Hand Separation
Nipper Separation
Medium
(1) Board Separation Jig
Medium
(2) Disc Separator
Low
Recommended
Notes
Hand and nipper
separation apply a high
level of stress.
Use another method.
· Board handling
· Board bending direction
· Layout of capacitors
· Board handling
· Layout of slits
· Design of V groove
· Arrangement of blades
· Controlling blade life
Board handling
(3) Router Type Separator
Board Separation Apparatus
* When a board separation jig or disc separator is used, if the following precautions are not observed, a large board deflection stress will occur and the capacitors
may crack. Use router type separator if at all possible.
(1) Example of a suitable jig
[In the case of Single-side Mounting]
An outline of the board separation jig is shown as
follows. Recommended example: Stress on the
component mounting position can be minimized by
holding the portion close to the jig, and bend in the
direction towards the side where the capacitors
are mounted. Not recommended example: The risk
of cracks occurring in the capacitors increases due
to large stress being applied to the component
mounting position, if the portion away from the jig
is held and bent in the direction opposite the side
where the capacitors are mounted.
[Outline of Jig]
Load Point
Load Point
Board Cropping Jig
V-groove
Printed Circuit Board
Components
Components
Printed Circuit Board
Direction of Load
Direction of Load
Printed Circuit Board
Not Recommended
Recommended
[In the case of Double-sided Mounting]
Since components are mounted on both sides of the
board, the risk of cracks occurring can not be
avoided with the above method.
Therefore, implement the following measures to
prevent stress from being applied to the
components.
(Measures)
(1) Consider introducing a router type separator.
If it is difficult to introduce a router type separator,
implement the following measures. (Refer to item 1.
Mounting Position)
(2) Mount the components parallel to the board
separation surface.
(3) When mounting components near the board
separation point, add slits in the separation position
near the component.
(4) Keep the mounting position of the components
away from the board separation point.
Hand Separation
g
q
*
q
*
n
Continued from the preceding page.
Continued on the following page.
!
Note
• Please read rating and
!
CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
