Murata GA2 Manual Download

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Caution/Notice

GRM, GR3, GRJ, GR4, GR7, GJM,
GQM, GA2, GA3, LLL, LLA, LLM,
LLR, NFM, KRM, KR3, GMA, GMD

Caution

Notice

Storage and Operation Conditions

Rating

1. Temperature Dependent Characteristics

2. Measurement of Capacitance

3. Applied Voltage and Applied Current

4. Type of Applied Voltage and

Self-heating Temperature

5. DC Voltage and AC Voltage Characteristics

6. Capacitance Aging

7. Vibration and Shock

Soldering and Mounting

1. Mounting Position

2. Information before Mounting

3. Maintenance of the Mounting

(pick and place) Machine

4-1. Reﬂow Soldering

4-2. Flow Soldering

4-3. Correction of Soldered Portion

5. Washing

6. Electrical Test on Printed Circuit Board

7. Printed Circuit Board Cropping

8. Assembly

9. Die Bonding/Wire Bonding

Other

1. Under Operation of Equipment

2. Other

Rating

1. Operating Temperature

2. Atmosphere Surroundings

(gaseous and liquid)

3. Piezo-electric Phenomenon

Soldering and Mounting

1. PCB Design

1. Notice for Pattern Forms

2. Land Dimensions

3. Board Design

2. Adhesive Application

3. Adhesive Curing

4. Flux for Flow Soldering

5. Flow Soldering

6. Reﬂow Soldering

7. Washing

8. Coating

Other

1. Transportation

2. Characteristics Evaluation

in the Actual System

Note

• Please read rating and

CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Summary of Contents for GA2

Page 1: ... Board 7 Printed Circuit Board Cropping 8 Assembly 9 Die Bonding Wire Bonding Other 1 Under Operation of Equipment 2 Other Rating 1 Operating Temperature 2 Atmosphere Surroundings gaseous and liquid 3 Piezo electric Phenomenon Soldering and Mounting 1 PCB Design 1 Notice for Pattern Forms 2 Land Dimensions 3 Board Design 2 Adhesive Application 3 Adhesive Curing 4 Flux for Flow Soldering 5 Flow Sol...

Page 2: ...ature changes The following actions are recommended in order to ensure suitable capacitance values 1 Select a suitable capacitance for the operating temperature range 2 The capacitance may change within the rated temperature When you use a high dielectric constant type capacitor in a circuit that needs a tight narrow capacitance tolerance e g a time constant circuit please carefully consider the t...

Page 3: ...ltage Pulse Voltage E 0 E 0 E 0 E 0 4 Type of Applied Voltage and Self heating Temperature 1 Conﬁrm the operating conditions to make sure that no large current is ﬂowing into the capacitor due to the continuous application of an AC voltage or pulse voltage When a DC rated voltage product is used in an AC voltage circuit or a pulse voltage circuit the AC current or pulse current will ﬂow into the c...

Page 4: ...undamental frequency may be included In such a case please contact Murata The excessive generation of heat may cause deterioration of the characteristics and reliability of the capacitor Absolutely do not perform measurements while the cooling fan is operating as an accurate measurement may not be performed The surface temperature of the capacitor 125 C or less including self heating The sine wave...

Page 5: ...200 Allowable Voltage Vp p 1000 Frequency kHz 1000 100 10 1 10 100 250 Allowable Voltage Vp p 1000 Frequency kHz 1000 100 10 1 10 100 500 Allowable Voltage Vp p 1000 U2J 7U char Rated Voltage DC250V to 2 200pF 4 700pF 4 700pF 10 000pF 10 000pF 22 000pF 22 000pF 47 000pF 47 000pF to 2 200pF 2 200pF 4 700pF 10 000pF 22 000pF 47 000pF to 1 000pF The sine wave frequency VS allowable voltage The surfac...

Page 6: ... 50 40 30 20 10 0 10 20 30 0 0 5 1 1 5 2 AC Voltage Vr m s 100 80 60 40 20 0 20 0 10 20 30 40 50 DC Voltage V Example of DC Voltage Characteristics Sample X7R R7 Characteristics 0 1μF Rated Voltage 50VDC Example of AC Voltage Characteristics Sample X7R R7 Characteristics 10μF Rated Voltage 6 3VDC Capacitance Change Capacitance Change 6 Capacitance Aging 1 The high dielectric constant type capacito...

Page 7: ...at 1 Mounting Position Locate chip horizontal to the direction in which stress acts It is effective to implement the following measures to reduce stress in separating the board It is best to implement all of the following three measures however implement as many measures as possible to reduce stress Component Direction Chip Mounting Close to Board Separation Point When a capacitor is mounted near ...

Page 8: ...of chip 5 To control mounting speed carefully because ZRB series is heavier than standard MLCC Board Guide Correct Suction Nozzle Board Support Pin Incorrect Deﬂection 2 Information before Mounting 1 Do not re use capacitors that were removed from the equipment 2 Conﬁrm capacitance characteristics under actual applied voltage 3 Conﬁrm the mechanical stress under actual process and equipment use 4 ...

Page 9: ...ing Soldering Preheating 220 C 200 C 190 C 170 C 170 C 150 C 150 C 130 C Time Temperature C Peak Temperature Pb Sn Solder Sn 37Pb Lead Free Solder Sn 3 0Ag 0 5Cu 3 When a capacitor is mounted at a temperature lower than the peak reﬂow temperature recommended by the solder manufacturer the following quality problems can occur Consider factors such as the placement of peripheral components and the r...

Page 10: ... Continued from the preceding page Continued on the following page 100 150μm NFM15 18 21 3D 31 100 200μm NFM41 Guideline of solder paste thickness 2 6 2 5 4 4 1 0 0 6 1 2 NFM21PS 2 0 2 5 3 9 1 0 0 6 0 8 NFM3DCC 3DPC NFM31PC 31KC NFM18PS 2 6 3 5 5 5 1 5 0 6 1 0 NFM41CC 41PC NFM15CC 15PC 2 2 1 0 0 4 0 6 1 2 NFM18CC 18PC 0 4 NFM21CC 21PC 1 4 2 6 0 6 0 8 0 6 1 9 0 8 0 4 0 1 1 2 1 2 0 05 2 0 0 85 1 85 ...

Page 11: ...ponents will decrease because a sudden temperature change causes deformation inside the components In order to prevent mechanical damage to the components preheating is required for both of the components and the PCB Preheating conditions are shown in table 2 It is required to keep the temperature differential between the solder and the components surface ΔT as low as possible 3 Excessively long s...

Page 12: ...spot heater to the component is too close cracks may occur due to thermal shock To prevent this problem follow the conditions shown in Table 4 2 2 In order to create an appropriate solder ﬁllet shape it is recommended that hot air be applied at the angle shown in Figure 1 3 Optimum solder amount when re working with a soldering iron 3 1 If the solder amount is excessive the risk of cracking is hig...

Page 13: ...ounting on the printed circuit board 1 1 Avoid bending the printed circuit board by the pressure of a test probe etc The thrusting force of the test probe can ﬂex the PCB resulting in cracked chips or open solder joints Provide support pins on the back side of the PCB to prevent warping or ﬂexing Install support pins as close to the test probe as possible 1 2 Avoid vibration of the board by shock ...

Page 14: ...rs increases due to large stress being applied to the component mounting position if the portion away from the jig is held and bent in the direction opposite the side where the capacitors are mounted Outline of Jig Load Point Load Point Board Cropping Jig V groove Printed Circuit Board Components Components Printed Circuit Board Direction of Load Direction of Load Printed Circuit Board Not Recomme...

Page 15: ...ade Top Blade Bottom Blade Top Blade Bottom Blade Top Blade Bottom Blade Top Blade Printed Circuit Board V groove Recommended Not Recommended Top bottom Misalignment Left right Misalignment Front rear Misalignment 3 Example of Router Type Separator The router type separator performs cutting by a router rotating at a high speed Since the board does not bend in the cutting process stress on the boar...

Page 16: ...th support pins or a dedicated jig before insertion Support below the board so that the board does not bend When using support pins on the board periodically conﬁrm that there is no difference in the height of each support pin 2 3 Attaching Removing Sockets and or Connectors Insertion and removal of sockets and connectors etc might cause the board to bend Please insure that the board does not warp...

Page 17: ...e Bonding of Capacitors 1 1 Use the following materials for the Brazing alloys Au Sn 80 20 300 to 320 C in N2 atmosphere 1 2 Mounting 1 Control the temperature of the substrate so it matches the temperature of the brazing alloy 2 Place the brazing alloy on the substrate and place the capacitor on the alloy Hold the capacitor and gently apply the load Be sure to complete the operation within 1 minu...

Page 18: ...e with equipment capable of creating a wave similar to a 50 60Hz sine wave 2 Voltage Applied Method The capacitor s lead or terminal should be ﬁrmly connected to the output of the withstanding voltage test equipment and then the voltage should be raised from near zero to the test voltage If the test voltage is applied directly to the capacitor without raising it from near zero it should be applied...

Page 19: ...ern Forms 1 1 Unlike leaded components chip components are susceptible to ﬂexing stresses since they are mounted directly on the substrate They are also more sensitive to mechanical and thermal stresses than leaded components Excess solder ﬁllet height can multiply these stresses and cause chip cracking When designing substrates take land patterns and dimensions into consideration to eliminate the...

Page 20: ...low soldering can only be used for products with a chip size from 1 6x0 8mm to 3 2x1 6mm Solder Resist a b c Chip Capacitor Land Continued from the preceding page Continued on the following page Chassis Solder ground Electrode Pattern Solder Resist Solder Resist Solder Resist Lead Wire Soldering Iron Lead Wire Solder Resist Pattern Forms Placing Close to Chassis Placing of Chip Components and Lead...

Page 21: ...o 0 5 0 4 to 0 6 0 6 to 0 8 0 7 to 0 9 1 0 to 1 2 1 2 1 2 1 0 to 1 4 2 2 to 2 5 1 8 to 2 0 1 9 to 2 1 2 0 to 2 4 2 8 to 3 4 3 0 to 3 5 4 0 to 4 6 4 0 to 4 6 0 15 to 0 2 0 20 to 0 25 0 2 to 0 3 0 4 to 0 5 0 6 to 0 8 0 12 to 0 18 0 2 to 0 3 0 25 to 0 35 0 25 to 0 35 0 35 to 0 45 0 4 to 0 5 0 6 to 0 7 0 7 to 0 8 0 6 to 0 7 0 6 0 6 to 0 8 0 6 to 0 8 0 8 to 1 0 0 9 to 1 2 1 0 to 1 3 1 0 to 1 2 1 2 to 1...

Page 22: ...anical stress from the PCB Recommended slit design is shown in the Table 1 6g0 8 2 0g1 25 3 2g1 6 3 2g2 5 4 5g2 0 4 5g3 2 5 7g2 8 5 7g5 0 1 0 to 2 0 1 0 to 2 0 1 0 to 2 8 1 0 to 2 8 1 0 to 4 0 1 0 to 4 0 3 2 to 3 7 4 1 to 4 6 3 6 to 4 1 4 8 to 5 3 4 4 to 4 9 6 6 to 7 1 LgW d e in mm Applicable to beyond Rated Voltage of 200VDC Land Solder Resist L W Chip Capacitor Slit d e Series Chip Dimension Co...

Page 23: ... less than 1mm per 1A 1mm A For example in case of 10A signal land pattern width should be 10mm or more 1mm A 10A 10mm 1 For large current design width of signal land pattern should be wider not less than 1mm per 1A 1mm A For example in case of 10A signal land pattern width should be 10mm or more 1mm A 10A 10mm Small diameter thru hole ø0 4 1 4 1 0 1 2 0 6 2 6 3 0 2 5 4 4 NFM31KC 1 10mm or more in...

Page 24: ...trength must not decrease when exposed to moisture during soldering 3 The adhesive must have good coatability and shape retention properties 4 The adhesive must have a long pot life 5 The curing time must be short 6 The adhesive must not be corrosive to the exterior of the capacitor or the board 7 The adhesive must have good insulation properties 8 The adhesive must not emit toxic gases or otherwi...

Page 25: ...x containing too high a percentage of halide may cause corrosion of the terminations unless there is sufficient cleaning Use ﬂux with a halide content of 0 1 max 3 Strong acidic ﬂux can corrode the capacitor and degrade its performance Please check the quality of capacitor after mounting 3 Adhesive Curing 1 Insufficient curing of the adhesive can cause chips to disconnect during ﬂow soldering and ...

Page 26: ...A 2 1 2 pattern to be mounted and the mounting location Be sure to verify the effect on the actual device in advance Other Continued from the preceding page 0 7 31 2 2 0 3 2 2 120 11 of the thermal contraction of the resin during curing process The stress is affected by the amount of resin and curing contraction 2 0 1 5 2 5 30 20 2 The difference in the thermal expansion coefficient 25 2 0 1 0 0 1...

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