2.7
Minimum
distances
and
burnable
construction materials
Depending on valid regulations, other minimum distances
could be applied, different than mentioned below.
Comply with regulations of electrical installations and
minimum distances which are in force in the subject
country
Minimum distance for heavy inflammable and self-
extinguishing materials is 200 mm
Inflammability of components
A
Non-inflammable
A1:
Non-inflammable
Asbestos, stone, wall tiles, baked
clay, plaster (with no organic
additives)
A2:
With smaller
quantity of
added
elements
(organic
components)
Plaster cardboards plates, base
felt, glass fibres, plates of
ACUMIN, ISOMIN, RAIOT,
LOGNOS, VELOX, AND
HERACLITUS
B
Inflammable
B1:
Hardly inflammable
Beech, oak, veneered wood, felt,
HOBREX,
VERSALIT and
UMAKART plates
B2:
Normally
inflammable
Pine, larch and spruce,
veneered
wood
B3:
Inflammable
Asphalt, cardboard, cellulose
materials, tar-paper, plywood
plates,
cork plates, polyurethane,
polystyrene,
polyethylene, floor
fibre materials
Table 2:
Ignitable materials and composition of elements
according to DIN 4102
2.8
Product description
Basic components of boiler:
Boiler body
Device frame and casing
Control unit
Pump
Expansion dish (8
l
)
Processor board and boiler electronics
Water pressure sensor
Safety valve
Boiler can be installed as integral part of the central heating system,
floor heating, hybrid, or accumulation systems
.
Boiler is compounded of weld housing of steel tin with thermal
insulation. The boiler is fixed on the wall by supplied mounting set.
Installed heating insulation in boiler jacket reduces loss of the heat,
and also protects against noise
.
Safety elements (vent valve, managing surface fuse and
temperature safety limitation) are mounted at the top of boiler
.
Depending on the type of the boiler, different elements of
heating are used. Heating elements’ performance can be
adjusted according to grades
.
Different performance grades sets can be obtained through
control panel. Number and division of performance grades are
visible from technical data (see chapter
2.12.2).
Device data
