Microchip Technology SC70-6, User Manual

Page: 22 / 43

SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide
DS51874A-page 22
©
2009 Microchip Technology Inc.
2.4.8 The PCB as a SC70, SOT-23 to DIP Socket Converter
There may be occasions when it is desirable to convert the footprint of the device to
that of a DIP package. This allows the device to be installed into an existing DIP socket.
Two 1x4 row pins need to be installed into the PCB’s DIP footprint (on the bottom) when
the device is installed into the appropriate package footprint.
This allows the PCB to convert the SC70 and SOT-23 footprints to a 300-mil DIP-8 foot-
print.
TABLE 2-4: SUPPORTED DIGITAL POTENTIOMETERS
Device SC70 SOT-23 DIP Comment
MCP4012 — Yes — SOT-23-6, uses Up/Down interface
MCP4013 — Yes — SOT-23-6, uses Up/Down interface
MCP4014 — Yes — SOT-23-5, uses Up/Down interface
MCP4017 Yes — —
MCP40D17 Yes — —
MCP4018 Yes — —
MCP40D18 Yes — —
MCP4019 Yes — —
MCP40D19 Yes — —
MCP4022 — Yes — SOT-23-6, uses Up/Down interface
MCP4023 — Yes — SOT-23-6, uses Up/Down interface
MCP4024 — Yes — SOT-23-5, uses Up/Down interface
MCP4131 — — Yes Has multiplexed SDI/SDO
MCP4132 — — Yes
MCP4141 — — Yes Has multiplexed SDI/SDO
MCP4142 — — Yes
MCP4151 — — Yes Has multiplexed SDI/SDO
MCP4152 — — Yes
MCP4161 — — Yes Has multiplexed SDI/SDO
MCP4162 — — Yes
MCP41010 — — Yes
MCP41050 — — Yes
MCP41100 — — Yes