Microchip Technology SC70-6, User Manual

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Installation and Operation
©
2009 Microchip Technology Inc. DS51874A-page 15
2.4 SC70-6 AND SOT-23-6/8 TO DIP-8 EVALUATION BOARD DESCRIPTION
The SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board PCB is designed to be flexible
in the type of device evaluation that can be implemented.
The following sections describe each element of this evaluation board in further detail.
Refer to Figure 2-3.
2.4.1 Power and Ground
The SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board has a VDD Pad and a VSS
pad. These pads can have connection posts installed that allows easy connection to
the power (V
DD
) and ground (V
SS
) planes. The layout allows either through-hole or
surface-mount connectors.
The power and ground planes are connected to the appropriate passive components
on the PCB (such as power plane to RXU and ground plane to RXD components).
2.4.2 PCB PADs
For each package pin (pins 1 to 8), there is a PCB pad (pads 1 to 8). The device will
have some power pins (V
DD
) and some ground pins (V
SS
). To ease connections on the
PCB, vias to the power and ground plane have been installed close to each PCB pad.
This allows any pad to be connected to the power or ground plane (see Figure 2-3). So
when power is connected to the VDD and VSS pads, the power is connected to the
appropriate device pin.
FIGURE 2-3: Connecting the PCB pad to either VDD or VSS.
TABLE 2-1: OPTIONAL PASSIVE COMPONENTS
(2)
Component Comment
C1, C2 Power supply bypass capacitors
R1U, R2U, R3U, R4U, R5U, R6U, R7U, R8U Pull-up resistor
R1D, R2D, R3D, R4D, R5D, R6D, R7D, R8D Pull-down resistor
(1)
Note 1: Whichever pin is the device’s VDD pin, that corresponding RXD footprint can be
used for the device’s bypass capacitor. So if Pin 8 is the device’s VDD pin, then
install the bypass capacitor in the R8D footprint.
2: All passive components use the surface mount 805 footprint
Jumpering to VSS Jumpering to VDD
or
or
0
Ω
0
Ω