Introduction
2016 Microchip Technology Inc.
Advance Information
DS70005274A - Page 15
1.2
BM63 EVB FEATURES
The following are key features of the BM63 EVB:
• The BM63 EVB includes a BM63 module, qualified for Bluetooth 4.2 specifications
• On-board MCU (PIC18F85J10) and DSP (YDA174) for easy operation and
feature demonstration
• On-board keypad matrix that is controlled by MCU, which makes it easy for play-
back control
• Built-in Near Field Communication (NFC)
• RoHS compliant
Figure 1-2
illustrates the top view of the BM63 EVB with the following components:
1.
BM63SPKA1MC2 module
2.
Three status LEDs
3.
NFC tag
4.
Mode switch (SW9)
5.
USB connector (P9)
6.
USB to UART converter (MCP2200)
7.
UART port over USB connector (P3)
8.
On board MCU (PIC18F85J10)
9.
ICSP header (J5)
10. Audio control buttons, Multi-Function Button (MFB) and pairing mode button
11. 15V adapter jack (P2)
12. Internal/external MCU selection switch (SW46)
13. Internal/external DSP audio amplifier selection switch (SW47)
14. On-board DSP (YDA174) with built-in audio amplifier
15. Audio connector (CN1 and CN2)
16. External MCU/DSP header (J6)
17. Auxiliary input 3.5 mm jack (P8)
18. Microphone input 3.5 mm jack (P6)
19. Speaker output 3.5 mm jack (P7)
20. Reset button for the BM63 module (SW10)
21. Reset button for MCU (SW1)
For additional information on the features, refer to
Chapter 2. “Hardware”
.
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