mfh systems E-NERGY CARBON BASIC TT 1200, Installation Instructions & Operating Manual, Page: 8 / 32

08
U
max
W/(m
2
*K) R
min
m
2
*K/W
Mezzanine floors above heated rooms 1,25 0,75
Mezzanine floors above partially heated rooms 0,75 1,25
Heating surfaces between outside air or ground 0,35 2,86
Basement ceilings, walls or ceilings against unheated rooms 0,35 2,86
Minimum heat transfer coefficient and minimum thermal resistance of components.
plugs for electrical insulation. In addition, two screws must not be fitted with an electrically conductive material
(e.g. metal picture frame, metal trim, metal shelving system). Do not use nails.
3.2.1. Pretreatment of the substrate
The heating foil can be applied to any load-bearing, clean and level surface made of inorganic materials such as
stone, screed, plaster, etc. or organic materials such as wood, cork, plastic (possibly with surface primer / adhesion
promoter), etc. The substrate and top layer materials must be suitable for the use of an electric panel heating
system. If in doubt, contact the manufacturer of these materials.
Irregular surfaces are to be avoided (e.g. visible wood/stone - brickwork). Under certain circumstances, the surface
must be levelled in advance with levelling plaster or levelling compound. Special care must be taken to ensure that
no sharp projections such as stones, screw heads, nails or similar protrude from the substrate.
On walls and ceilings, drywall panels and wood-based panels must be installed to bridge cracks in the joint area.
When installing on the floor, dry screeds and wood-based panels must always be laid in two layers and offset.
For a floating installation without gluing, e.g. between screed and laminate, we recommend approx. 2 mm of
levelling cork layer or glass fibre fleece should be laid under the heating foil.
3.2.2. Thermal insulation
Thermal insulation in the floor and wall area is recommended to reduce the heat emission into the masonry and
the floor. In order to limit the downward heat flow, the following minimum ratio of the heat transfer coefficient of
the floor structure above the insulation layer and the heat transfer coefficient for all layers below the load distribu-
tion layer must be maintained (according to EN 50559:2013-12):
• Mezzanine floor, above heated rooms: U max: 1.25 W/(m2*K)
• Mezzanine floors above partially heated rooms: U max: 0.75 W/(m2*K)
• basement ceilings, walls and ceilings against unheated rooms as well as ceilings and walls that are connected to
the ground border: U max: 0.35 W/(m2*K)
The insulation layers under the floor construction should be selected according to the following table. Minimum
heat transfer coefficients must be observed. Only standardised insulation materials suitable for underfloor heating
may be used. The compressibility of the insulation layer must not exceed 5 mm. If several layers are used, the
compressibility of the individual layers must be added together.