MeiG_SLM550_Hardware Design Manual
MeiG Smart Technology Co., Ltd
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7.2 Recommended Soldering Furnace Temperature Curve
Figure 46 Module recommended soldering furnace temperature curve
7.3 Humidity Sensitivity (MSL)
The SLM550 module meets moisture sensitivity level 3. The dry package is subjected to the J-STD-
020C specification in accordance with the IPC/JEDEC standard under ambient conditions of
temperature <30
℃
and relative humidity <60%. Under ambient conditions of temperature <40
℃
and
relative humidity <90%, the shelf life is at least 6 months without unpacking. After unpacking, Table 22
lists the shelf life of the modules for different moisture sensitivity levels.
Table 32 Humidity sensitivity level distinction
Grade
Factory environment
≦
+30
℃
/60%RH
1
Indefinite quality in the environment
≦
+30
℃
/85% RH Under conditions
2
1 year
2a
4 weeks
3
168 hours
4
72 hours
5
48 hours
5a
24 hours
6
Use it after forced baking. After baking, the module must be patched within the time
limit specified on the label.
