Matsushita Electric DMR-ES15PL, Service Manual

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2.3. Service caution based on legal restrictions
2.3.1. General description about Lead Free Solder (PbF)
The lead free solder has been used in the mounting process of all electrical components on the printed
circuit boards used for this equipment in considering the globally environmental conservation.
The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the
alloy mainly consists of tin (Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free
solder is higher approx.30 degrees C (86°F) more than that of the normal solder.
Definition of PCB Lead Free Solder being used
The letter of “PbF” is printed either foil side or components side on the PCB
using the lead free solder.
(See right figure)
Service caution for repair work using Lead Free Solder (PbF)
- The lead free solder has to be used when repairing the equipment for
which the lead free solder is used.
(Definition: The letter of “PbF” is printed on the PCB using the lead free
solder.)
- To put lead free solder, it should be well molten and mixed with the
original lead free solder.
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