27
LTC3729
sn3729 3729fas
PACKAGE DESCRIPTIO
U
G Package
28-Lead Plastic SSOP (0.209)
(LTC DWG # 05-08-1640)
G28 SSOP 1098
0.13 – 0.22
(0.005 – 0.009)
0
°
– 8
°
0.55 – 0.95
(0.022 – 0.037)
5.20 – 5.38**
(0.205 – 0.212)
7.65 – 7.90
(0.301 – 0.311)
1
2 3
4
5
6 7 8
9 10 11 12
14
13
10.07 – 10.33*
(0.397 – 0.407)
25
26
22 21 20 19 18 17 16 15
23
24
27
28
1.73 – 1.99
(0.068 – 0.078)
0.05 – 0.21
(0.002 – 0.008)
0.65
(0.0256)
BSC
0.25 – 0.38
(0.010 – 0.015)
NOTE: DIMENSIONS ARE IN MILLIMETERS
DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.152mm (0.006") PER SIDE
DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.254mm (0.010") PER SIDE
*
**
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
UH Package
32-Lead Plastic QFN (5mm
×
5mm)
(Reference LTC DWG # 05-08-1693)
5.00
±
0.10
(4 SIDES)
NOTE:
1. DRAWING PROPOSED TO INCLUDE JEDEC PACKAGE OUTLINE
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
PIN 1
TOP MARK
0.40
±
0.10
31
1
2
32
BOTTOM VIEW—EXPOSED PAD
3.45
±
0.10
(4-SIDES)
0.75
±
0.05
R = 0.115
TYP
0.23
±
0.05
(UH) QFN 0102
0.50 BSC
0.200 REF
0.00 – 0.05
0.57
±
0.05
3.45
±
0.05
(4 SIDES)
4.20
±
0.05
5.35
±
0.05
0.23
±
0.05
PACKAGE OUTLINE
0.50 BSC
RECOMMENDED SOLDER PAD LAYOUT
(For purposes of clarity, drawings are not to scale)
