Linear Technology Analog Devices LT8607, Datasheet

Page: 20 / 22

LT8607/LT8607B
20
Rev. C
For more information www.analog.com
PACKAGE DESCRIPTION
2.00 ± 0.05
(4 SIDES)
2.00 SQ
±
0.05
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.55 ± 0.05
BOTTOM VIEW—EXPOSED PAD
0.23
REF
0.335
REF
0.335 REF
0.75 ± 0.05
1
4
8 5
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DC8MA) DFN 0113 REV Ø
0.23 ± 0.05
0.45 BSC
0.25 ± 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.90
REF
0.23
REF
0.85
±
0.05
1.8 REF
1.8 REF
2.60
±
0.05
PACKAGE
OUTLINE
0.45 BSC
PIN 1 NOTCH
R = 0.15
DC8 Package
8-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1939 Rev Ø)
Exposed Pad Variation AA