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4.1.3 Disassembly of Lower Case
1. Use a '-' type driver to release from the hooks on Lower case.
Then, lift up the PCB for final disassembly.
2. Insert a small '-'type driver between the shield-can and cover, and lift up along the flat side of the
lower case.
Figure 4-5. Removing the PCB
3. Lift up the rubber part of multi-key, and then the Dial BTN will be disassembled from the Lower
Case.
4. While holding the Lower case with your left hand, use your right hand to twist the flip-cover to the
hinges.
Assembly : Leave the flip cover open and insert one side of the flip-cover into the hinge as
shown in fig.4-6. Then twist the flip-cover when inserting the other end. DO NOT use
too much force onto it. Make sure the flip is working properly, after the assembly.
Figure 4-6. Removing the Flip
Summary of Contents for LG500
Page 1: ...GSM Phone SERVICE MANUAL MODEL LG 500 SERVICE MANUAL MODEL LG 500 ...
Page 37: ... 36 6 PCB Diagram Testpoint Description ...
Page 38: ... 37 6 PCB Diagram Testpoint Description ...
Page 39: ... 38 ...
Page 41: ... 40 7 2 RF Block Diagram ...
Page 42: ... 41 8 Schematic Diagram 8 Schematic Diagram ...
Page 43: ... 42 8 1 Baseband ...
Page 44: ... 43 8 Schematic Diagram 8 1 1 Baseband ...
Page 45: ... 44 8 1 2 Memory devices ...
Page 46: ... 45 8 Schematic Diagram 8 1 3 Audio ...
Page 47: ... 46 8 1 4 MMI ...
Page 48: ... 47 8 Schematic Diagram 8 2 RF top schematic 8 2 1 Baseband parts in RF ...
Page 49: ... 48 8 2 2 Pascal RF ...
Page 50: ... 49 8 Schematic Diagram 8 2 3 Hitachi PA ...
Page 51: ... 50 ...
Page 62: ...2 Specification Feature 61 ...
Page 63: ...P N AMBB0000201 April 2001 ...