4. Disassembly/Reassembly
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4.1.4 Disassembly of Lower-Case Components
1. Use a pin to lift up the microphone to the direction as shown in fig. 4-7.
2. Use a pin to release the Receiver.
Figure 4-7. Removing the Receiver
3. Insert a '-'type driver between the hinge and the Lower case, and lift it up to remove the hinge.
4. See the cover from the A-direction shown in fig. 4-8, and assemble a pink hinge on its left and a
green hinge on its right.
Figure 4-8. Removing the Hinge
Summary of Contents for LG500
Page 1: ...GSM Phone SERVICE MANUAL MODEL LG 500 SERVICE MANUAL MODEL LG 500 ...
Page 37: ... 36 6 PCB Diagram Testpoint Description ...
Page 38: ... 37 6 PCB Diagram Testpoint Description ...
Page 39: ... 38 ...
Page 41: ... 40 7 2 RF Block Diagram ...
Page 42: ... 41 8 Schematic Diagram 8 Schematic Diagram ...
Page 43: ... 42 8 1 Baseband ...
Page 44: ... 43 8 Schematic Diagram 8 1 1 Baseband ...
Page 45: ... 44 8 1 2 Memory devices ...
Page 46: ... 45 8 Schematic Diagram 8 1 3 Audio ...
Page 47: ... 46 8 1 4 MMI ...
Page 48: ... 47 8 Schematic Diagram 8 2 RF top schematic 8 2 1 Baseband parts in RF ...
Page 49: ... 48 8 2 2 Pascal RF ...
Page 50: ... 49 8 Schematic Diagram 8 2 3 Hitachi PA ...
Page 51: ... 50 ...
Page 62: ...2 Specification Feature 61 ...
Page 63: ...P N AMBB0000201 April 2001 ...