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LGE Internal Use Only
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. BB Circuit Technical brief
GM310f service manual
3.2.1 General description
S-GOLD3H-LC is a HSDPA/WCDMA/EDGE/GPRS/GSM system in package solution consisting of a
mixed signal baseband IC with a 3G coprocessor IC.
l Baseband IC containing all analog and digital functionality of a cellular radio. Additionally S-
GOLD3
TM
Provides multimedia extensions such as camera, software MIDI, MP3 sound. It is designed
as a single chip solution, integrating the digital and mixed signal portions of the base band in 0.09um,
1.2V technology.
The chip will support the FR, EFR, HR and AMR-NB vocoding.
S-GOLD3
TM
support multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data
application (up to class 12), EGPRS (up to class 12) and DTM(class11) without additional external
hardware.
3.2.2. Block Description
z
Processing core
ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU,
and the Jazelle Java extension for Java acceleration.
- TEAKLite DSP core
z
ARM-Memory
- 32k Byte Boot ROM on the AHB
- 128k Byte SRAM on the AHB, flexibly usable as program or data RAM
- 32k Byte Instruction Cache
- 32k Byte Data Cache
- 8k Byte Instruction Tightly coupled Memory(I-TCM)
- 8k Byte Data tightly coupled memory (D-TCM)
z
DSP-Memory
- 120k x 16bit Program ROM
- 8k x 16bit Program RAM
- 72k x 16bit Data ROM
- 48k x 16bit Data XRAM
-5k x 16bit Data YRAM
- Incremental Redundancy(IR) Memory of 35904 words of 16bit