2.2.2 Thermal Design and Analysis (24W COB PKG)
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- Simulation S/W : Flotherm (Mentor Graphics)
- Environmental conditions(Ta) : 25
℃
- Heat dispersion condition : natural convection
-Thermal Grease : 4.5W/mK
- Heatsink material : Al(thermal conductivity :180W/mK)
- Heatsink dimension : 125.5 (W) X 60 (H) X 80 (L
h
)mm
- Fin number : 13ea
- Fin length : 55mm
- Fin thickness : 1.9mm
H
G
21
A simulation is an effective procedure with regard to thermal design. Simulation results
from when the COB LED was attached to the heat sink with TIM* are shown as below.
* TIM : Thermal Interface Material
** The surface area of heat sink is controlled with variation of L
h
.
Junction temperature vs. Surface area of heat sink**
The junction temperature vs. power consumption
2.2 Thermal Properties and Simulation
2. Product & Technical Guide
