Lenovo Thinkpad X230s, Hardware Maintenance Manual

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can cause a thermal problem due to imperfect contact with a component. If a thermal fan assembly needs
to be reused, remove and reapply thermal grease.
a
• Do not touch the thermal grease.
• Do not press, touch, or rotate the fan impeller.
• Do not touch the fan inlet hole.
• Do not twist or pull the cable of the thermal fan assembly.
• Do not apply pressure on the top and bottom covers of the thermal fan assembly.
• Do not press the heat pipe. Hold both sides of the heat pipe if you need to take the thermal fan assembly.
• Do not shake or drop the thermal fan assembly.
• Ensure that the fan connector is attached firmly.
• Replace the thermal fan assembly if you observe the following:
– The cover of the thermal fan assembly is deformed or damaged.
– There is abnormal noise during rotation.
1110 System board
Important notices for handling the system board
When handling the system board, observe the following:
• The system board has an accelerometer, which can be broken when several thousands of G-forces
are applied.
Note: Dropping a system board from a height of as little as 15 cm (6 inches) so that it falls flat on a hard
bench can subject the accelerometer to as much as 6000 G's of shock.
• Be careful not to drop the system board on a bench top that has a hard surface, such as metal, wood, or
composite.
• Avoid rough handling of any kind.
• At every point in the process, be sure not to drop or stack the system board.
• If you put a system board down, be sure to put it only on a padded surface such as an ESD mat or a
corrugated conductive material.
For access, remove the following FRUs in order:
•
“1010 Base cover assembly” on page 59
• “1020 Front battery” on page 60
• “1030 Rear battery” on page 61
• “1040 Memory module” on page 63
• “1060 Wireless LAN card” on page 66
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Hardware Maintenance Manual