Lenovo Moto Z4
Level 2 – Service and Repair Manual
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PAGE 80
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Flash PCB Removal
NOTE
The Flash PCB can be recovered
and reused after removal.
1.
Place the Lens Adhesive Heating Plate on
the Hot Plate.
2.
Set the Hot Plate to 80 °C (176 °F).
// CAUTION //
Do not set the Hot Plate temperature higher
than 80 °C (176 °F). Damage to the phone may
occur.
// CAUTION //
Use protective gloves when handling heated
phones.
NOTE
Preheating with an oven is also acceptable if
the oven is set to the same temperature.
3.
Place the Rear Housing on the Heating
Plate, lens side down.
4.
Heat the phone for 10 minutes.
NOTE
Perform the Flash PCB removal procedure
before the phone starts to cool off.