3: PCB Footprint and Module Dimensions
PremierWave® 2050 Through-Hole Adapter Integration Guide
24
MSD (Moisture Sensitive Device) Control for the Module
1. The PremierWave 2050 is a moisture sensitive device; the MSL level is 3.
2. Modules to be subjected to reflow solder or other high temperature processes must be
mounted within 168 hours of opening the vacuum containment bag in factory conditions.
3. The module requires baking before mounting, if:
a. The Humidity Indicator Card reads >10% when read at 23± 5°C
b. The MSL3 are not met
4. If baking is required, optional condition as below (refer to IPC/JEDEC J-STD-033):
a. Bake 9 hours @ 125°C (Tray base)
b. Bake 33 hours @ 90°C/
≦
5%RH (Tray base)
c. Bake 13 days @ 40°C/
≦
5%RH (Tape/Reel base)
Note:
After baking, the floor time of module should be recalculated.
Product Information Label
The product information label contains important information about your specific unit, such as
its part number, revision, manufacturing date code, product model, country of origin,
datamatrix barcode and MAC address.
Figure 3-3 PremierWave 2050 Product Label
