BT830 Hardware Integration Guide
Version 0.1 (PRELIMINARY)
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www.lairdtech.com/bluetooth
29
CONN-GUIDE-BT830
(PRELIMINARY)
13.3
Reflow Parameters
Laird surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB. Ultimately
it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during
reflow meet the requirements of the solder paste. Laird’s surface mount modules conform to J-STD-020D1 standards
for reflow temperatures.
Important: During reflow, modules should not be above 260° and not for more than 30 seconds.
Figure 13-22: Recommended Reflow Temperature
Temperatures should not exceed the minimums or maximums presented in
Table 18: Recommended Maximum and minimum temperatures
Specification
Value
Unit
Temperature Inc./Dec. Rate (max)
1~3
°C / Sec
Temperature Decrease rate (goal)
2-4
°C / Sec
Soak Temp Increase rate (goal)
.5 - 1
°C / Sec
Flux Soak Period (Min)
70
Sec
Flux Soak Period (Max)
120
Sec
Flux Soak Temp (Min)
150
°C
Flux Soak Temp (max)
190
°C
Time Above Liquidous (max)
70
Sec
Time Above Liquidous (min)
50
Sec
Time In Target Reflow Range (goal)
30
Sec
Time At Absolute Peak (max)
5
Sec
Liquidous Temperature (SAC305)
218
°C
Lower Target Reflow Temperature
240
°C
Upper Target Reflow Temperature
250
°C
Absolute Peak Temperature
260
°C
