LAIA TP-100, Administrator'S Manual

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
Do not place the device and its accessories in an environment where the
temperature is too low or too high.

Do not place the device near water or in a damp area.

Do not place anything on the device. It is recommended that you leave more than
10cm of heat dissipation space around the device.

Do not place the device near objects that are easily burnt, such as foam.

Keep the equipment clean and avoid dust pollution.

Keep away from heat sources or exposed sources of ignition, such as electric
heaters and candles.

Keep away from appliances with strong magnetic fields or strong electric fields,
such as microwave ovens, refrigerators, and mobile phones.
Usage Notice

Do not allow children to play with equipment and gadgets, to avoid suffocation
caused by playing product packaging bags, and to avoid dangers such as
swallowing.

Before touching the device, holding the card, circuit board, IC chip, etc., in order to
prevent the human body from damaging the sensitive components, you must wear
an anti-static wrist strap and ground the other end of the anti-static wrist strap.

Please use the accessories that come with the product and the accessories
recommended by the manufacturer, such as power adapters, batteries, etc.

Please ensure that the power supply voltage of the device meets the input voltage
requirements of the device. Please use the matching lightning protection power
strip.

Please ensure that the protection ground of the three-phase socket is effectively
grounded, and the neutral line and the live line are not reversed.

Please keep the power plug clean and dry. Do not use damaged or aged cables to
avoid the risk of electric shock.

Do not step on, pull or excessively bend the device cable to avoid equipment
failure.

Do not scratch or wear the outer casing of the device. Otherwise, the peeling paint
may cause allergies or abnormal equipment. If it falls into the main unit, it may
cause a short circuit.

Prevent foreign objects (such as metal) from entering the device through the heat
dissipation holes to avoid abnormal equipment.