Keysight LPDDR4, Installation Manual

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3 Introduction to W6602A LPDDR4 BGA Interposer
24 Keysight W6600A-series LPDDR4 BGA Interposers Installation Guide
W6602A Technical Features Summary
• Probes a JEDEC LPDDR4 BGA 200 footprint. Maximum of 10 mm wide X 15 mm long LPDDR4
DRAM package can fit on top of the W6601A interposer without an additional riser or a socket to
provide clearance for the RC components.
• Logic analyzer connections are made using U4207A Soft Touch Pro probe cables.
• RC components network is present on the top of the W6602A interposer. No RC network present
on the U4207A probe cables. Also, there are no RCs on the bottom of the interposer.
• The maximum non destructive input voltage for W6602A is 40 Vdc.
• Has a power plane and separate ground planes - 1.2 V (VDDQ) and 1.8 V (VDD1).
• Also provides VDD and VDDQ power filter capacitors to allow you to make power integrity
measurements using the Keysight Power Rail probe and Infiniium S-series oscilloscope.
W6602A Riser
An LPDDR4 BGA 200 ball riser is provided with each W6602A interposer to allow the interposer to
clear surrounding devices. Optionally, you can use a Grypper socket. It is not provided with the
interposer.
The following figure displays a riser that is provided with the W6602A interposer.
Figure 8 Riser that accompanies the W6602A interposer
To know how to solder the riser to the W6602A interposer and PC board, refer to the chapter
“W6600A-Series Interposers and Riser Soldering Guidelines" on page 31.
Pin 1 Marking
NOTE
The LPDDR 200 ball riser includes ground planes for optimal signal integrity. Due to these
ground planes, the riser’s alignment with the DRAM should be such that the TOP side of the
riser must point towards the DRAM and the Pin 1 indicator on the riser must orient towards the
“A1” pin of the DRAM.