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Service Information
6-2
Performance verification
The following paragraphs discuss performance verification
procedures for the Model 7022, including path resistance,
offset current, contact potential, and isolation.
With the Model 7022’s backplane jumpers installed, the per-
formance verification procedures must be performed with
only one card (the one being checked) installed in the Model
7001/7002 mainframe. These conditions do not apply if the
backplane jumpers are removed.
CAUTION
Contamination will degrade the
performance of the card. To avoid
contamination, always grasp the card
by the side edges. Do not touch the
connectors and do not touch the board
surfaces or components. On plugs and
receptacles, do not touch areas adjacent
to the electrical contacts.
NOTE
Failure of any performance verification
test may indicate that the card is contami-
nated. See the Handling and cleaning pre-
cautions paragraph to clean the card.
Environmental conditions
All verification measurements should be made at an ambient
temperature between 18° and 28°C and at a relative humidity
of less than 70%.
Recommended equipment
Table 6-1 summarizes the equipment necessary for perfor-
mance verification, along with an application for each unit.
Matrix connections
The following information summarizes methods that can be
used to connect test instrumentation to the connector card.
Detailed connection information is provided in Section 4.
One method to make instrument connections to the card is by
hard-wiring a 96-pin female DIN connector and then mating
it to the connector on the Model 7022. Row and column
shorting connections can also be done at the connector. The
connector in the Model 7011-KIT-R connection kit (see
Table 4-1) can be used for this purpose. Pin identification for
the multi-pin connector for the card is provided by
Figure 4-8 and Table 4-2.
WARNING
When wiring a connector, do not leave
any exposed wires. No conductive part
of the circuit may be exposed. Properly
cover the conductive parts, or death by
electric shock may occur.
CAUTION
After making solder connections to a
connector, remove solder flux as
explained in the Handling and cleaning
precautions paragraph. Failure to clean
the solder connections could result in
degraded performance preventing the
card from passing verification tests.
Before pre-wiring any connectors plugs, study the following
test procedures to fully understand the connection
requirements.
Table 6-1
Verification equipment
Description
Model
Specifications
Applications
DMM
Keithley Model 2000
100
Ω
; 0.01%
Path resistance
Electrometer w/voltage source
Keithley Model 6517A
20pA, 200pA; 1%
100V source; 0.15%
Offset current, path isola-
tion
Sensitive DVM
Keithley Model 182
3mV; 60 ppm
Contact potential
Triax cable (unterminated)
Keithley Model 7025
Offset current
Low thermal cable
(unterminated)
Keithley Model 1484
Contact potential
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