Keithley 7022, Instruction Manual

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4 Card Connections and Installation
Introduction ......................................................................................................................................................... 4-1
Handling precautions........................................................................................................................................... 4-1
Matrix connections .............................................................................................................................................. 4-2
Backplane row jumpers ............................................................................................................................... 4-2
Jumper removal ........................................................................................................................................... 4-2
Jumper installation....................................................................................................................................... 4-2
Digital I/O connections........................................................................................................................................ 4-2
Voltage source jumper................................................................................................................................. 4-2
Pull-up resistors ........................................................................................................................................... 4-3
Configuring digital I/O output logic............................................................................................................ 4-4
Configuring digital I/O input pull-up resistance ......................................................................................... 4-4
Multi-pin (mass termination) connector card ...................................................................................................... 4-5
Typical matrix connection schemes .................................................................................................................. 4-11
Single-card system..................................................................................................................................... 4-11
Two-card system ....................................................................................................................................... 4-12
Two-mainframe system ............................................................................................................................. 4-14
Typical digital I/O connection schemes ............................................................................................................ 4-16
Output connection schemes ....................................................................................................................... 4-16
Input connection scheme ........................................................................................................................... 4-17
Model 7022 installation and removal ................................................................................................................ 4-18
Card installation......................................................................................................................................... 4-18
Card removal ............................................................................................................................................. 4-18
Models 7022-D and 7022-DT ........................................................................................................................... 4-19
Internal connections................................................................................................................................... 4-19
Input/output connections ........................................................................................................................... 4-19
5 Operation
Introduction ......................................................................................................................................................... 5-1
Power limits......................................................................................................................................................... 5-1
Analog matrix maximum signal levels........................................................................................................ 5-1
Digital I/O maximum signal levels.............................................................................................................. 5-1
Mainframe control of the card ............................................................................................................................. 5-1
Channel assignments ................................................................................................................................... 5-2
Closing and opening channels ..................................................................................................................... 5-4
Scanning channels ....................................................................................................................................... 5-4
Reading input channels................................................................................................................................ 5-5
IEEE-488 bus operation .............................................................................................................................. 5-5
Matrix switching examples.................................................................................................................................. 5-7
Thick film resistor network testing.............................................................................................................. 5-7
Transistor testing ....................................................................................................................................... 5-10
Measurement considerations ............................................................................................................................. 5-12
Path isolation ............................................................................................................................................. 5-12
Magnetic fields .......................................................................................................................................... 5-13
Radio frequency interference .................................................................................................................... 5-13
Ground loops ............................................................................................................................................. 5-14
Keeping connectors clean.......................................................................................................................... 5-14
AC frequency response.............................................................................................................................. 5-14
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