System Overview
Intel
®
Carrier Grade Server TIGPT1U TPS
Revision
1.0
6
Up to two 1.0” Ultra-320 SCSI technology hard drives can be mounted in the hot swap drive bays,
which are located in the bottom front of the chassis. The front bezel needs to be removed to
access the hot swap drive trays when installing or removing them from the hot
swap driv
e bays.
Figure 2-2 shows the location of the two hot swap drive bays.
A slim-line CD-ROM drive can also be mounted in the system above the two hot swap drive
bays.
System boards include the extended front panel board, the power supply interface board, and
the SCSI hot swap backplane board. The extended front panel board is located in the front left
of the chassis, the power supply interface board is located in the mid left of the chassis, and the
SCSI hot swap backplane is located in the mid center and right of the chassis.
The 250 W power supply is mounted at the left-rear of the chassis. Two power supply options
are available, one with AC-input and one with DC-input.
The system contains a fan array consisting of two 40 x 48 mm fans and one 40 x 28 mm fans to
cool the SE7210TP1-E System Baseboard and other components. The fans are installed
directly behind the drive bays and are located in front of the baseboard. Another 40 x 28 mm
fan is located to the left of the hot swap drive bays and is used to cool the PCI adapter and left
side of the SE7210TP1-E System Baseboard. Individual fan connectors are located on the
system baseboard.
The front bezel can be customized to meet OEM industrial design requirements. The bezel
design allows adequate airflow to cool the system components. The front bezel is removed to
access the drive bay.
Figure 2-3 shows a block diagram of the Intel
®
Carrier Grade Server TIGPT1U with
interconnections.
