Intel
®
Carrier Grade Server TIGPT1U TPS
Introduction
Revision 1.0
Intel Secret
1
1. Introduction
This document provides an overview of the Intel
®
Carrier Grade Server TIGPT1U (
T
elecom
I
ndustrial
G
rade
P
rescot
t
1U
(1.75”) high) and includes information on chassis hardware,
cables, connectors, SE7210TP1-E System Baseboard, system boards, power subsystem, and
regulatory requirements.
1.1 Document Structure and Outline
This document is organized into the following chapters:
Chapter 1:
Introduction
Provides an overview of this document.
Chapter 2:
System Overview
Provides an overview of the Intel
®
TIGPT1U server chassis hardware.
Chapter 3:
Cables and Connectors
Describes the cables and connectors used to interconnect the system
board set and the Intel
®
TIGPT1U components.
Chapter 4:
Extended Front Panel System Board
Describes the specifications of the extended front panel system board.
Chapter 5:
Power Interconnect System Board
Describes the specifications of the power interconnect system board.
Chapter 6:
NEBS 3.3 V Riser Board
Describes the specifications of the Network Equipment Building
Specifications (NEBS) 3.3 V riser board.
Chapter 7:
Midplane Board
Describes the specifications of the midplane board.
Chapter 8:
DC Power Subsystem
Describes the specifications of the DC power subsystem.
Chapter 9:
AC Power Subsystem
Describes the specifications of the AC power subsystem.
Chapter 10: Regulatory Specifications
Describes system compliance to regulatory specifications.
