
Table of Contents
Intel® Server Board SE7520BD2 Technical Product Specification
vi
Revision
1.3
4.7.1
Front Panel............................................................................................................ 112
5.
Error Reporting and Handling ......................................................................................... 115
5.1
Error Propagation ...................................................................................................... 115
5.2
Fault Resilient Booting (FRB).................................................................................... 115
5.2.1
FRB-3 – BSP Reset Failures................................................................................. 115
5.2.2
FRB-2 – BSP POST Failures ................................................................................ 115
5.2.3
FRB-1 – BSP Self-Test Failures............................................................................ 116
5.2.4
OS Boot Timer - OS Load Failures ....................................................................... 116
5.2.5
Application Processor (AP) Failures...................................................................... 116
5.2.6
Treatment of Failed Processors ............................................................................ 116
5.3
Error Messages and Error Codes.............................................................................. 117
5.3.1
POST Error Codes and Messages........................................................................ 117
5.3.2
POST Error Beep Codes....................................................................................... 119
5.3.3
Checkpoints........................................................................................................... 120
5.4
Error Logging............................................................................................................. 122
5.4.1
Error Sources and Types ...................................................................................... 122
5.4.2
SMI Handler .......................................................................................................... 123
5.4.3
Logging Format Conventions ................................................................................ 124
5.4.4
POST Code Checkpoints ...................................................................................... 128
5.4.5
Boot Block Initialization Code Checkpoints ........................................................... 130
5.4.6
Boot Block Recovery Code Checkpoint ................................................................ 131
5.4.7
DIM Code Checkpoints ......................................................................................... 132
5.4.8
Single-bit ECC Error Throttling Prevention............................................................ 132
5.5
Reliability, Availability and Serviceability (RAS) Features......................................... 133
5.5.1
Memory RAS features ........................................................................................... 133
5.5.2
PCI Express .......................................................................................................... 133
5.5.3
RAS Features of FSB............................................................................................ 134
5.5.4
PCI-X..................................................................................................................... 134
5.5.5
RMC Connector Utilization .................................................................................... 134
5.5.6
Rolling BIOS.......................................................................................................... 135
6.
Connector Pin-outs and Jumper Blocks ........................................................................ 136
6.1
Board Connector Pin-outs ......................................................................................... 136
6.2
Board Jumper Blocks ................................................................................................ 142
6.2.1
Rolling BIOS Bank Selection Jumper .................................................................... 142
6.2.2
BIOS Recovery...................................................................................................... 142
6.2.3
Password Clear ..................................................................................................... 142
6.2.4
CMOS Clear .......................................................................................................... 143
7.
Environmental Specifications ......................................................................................... 144
7.1
Environmental Specifications and Cooling Requirements......................................... 144
7.2
Power Supply Requirements..................................................................................... 145
7.2.1
Baseboard Power Budget ..................................................................................... 145