Intel R2000WF series, Technical Product Specification

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Intel® Server System R2000WF Product Family Technical Product Specification
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Table 46. PCIe* add-in card airflow (LFM) support limits – R2208WFxxx, R220 8 drive accessory
kit, and R2308WFxxx
PCIe* Add-In Slot Riser Slot #1 Riser Slot #2 Riser Slot #3
Top 200 LFM 200 LFM 200 LFM
Middle 200 LFM 200 LFM 200 LFM
Bottom 300 LFM 300 LFM N/A
Note : Most PCI cards have cooling requirements of airflow up to 100 LFM (0.5 m/s). Some of the more
difficult to cool cards have airflow requirements of up to 200 LFM (1 m/s). The top and middle PCI locations
for the first riser have limited thermals during fan fail.
4.1.1 Memory Slot Population Requirements
System thermal requirements dictate that specific airflow be maintained over or between critical system
components. To ensure that proper air flow is achieved, specific memory slots must be populated with a
DIMM or factory installed DIMM blank while the system is in operation. Figure 30 and Figure 31 identify the
memory slots, identified with an arrow, which must be populated in all 2U system configurations.
Figure 30. System DIMM/DIMM blanks for 8x2.5, 16x2.5, and 8x3.5 drive configurations
Figure 31. System DIMM/DIMM blanks for 24x2.5 and 12x3.5 drive configurations
The following memory population rules apply when installing DIMMs:

DIMM population rules require that DIMMs within a channel be populated starting with the BLUE
DIMM slot or DIMM farthest from the processor in a “fill-farthest” approach.