Quad-Core Intel® Xeon® Processor 5300 Series Datasheet
87
Thermal Specifications
6
Thermal Specifications
6.1
Package Thermal Specifications
The Quad-Core Intel® Xeon® Processor 5300 Series requires a thermal solution to
maintain temperatures within its operating limits. Any attempt to operate the processor
outside these operating limits may result in permanent damage to the processor and
potentially other components within the system. As processor technology changes,
thermal management becomes increasingly crucial when building computer systems.
Maintaining the proper thermal environment is key to reliable, long-term system
operation.
A complete solution includes both component and system level thermal management
features. Component level thermal solutions can include active or passive heatsinks
attached to the processor integrated heat spreader (IHS). Typical system level thermal
solutions may consist of system fans combined with ducting and venting.
This section provides data necessary for developing a complete thermal solution. For
more information on designing a component level thermal solution, refer to the Quad-
Core Intel® Xeon® Processor 5300 Series Thermal/Mechanical Design Guidelines and
the Quad-Core Intel® Xeon® Processor LV5318 in Embedded Applications Thermal/
Mechanical Design Guidelines.
Note:
The boxed processor will ship with a component thermal solution. Refer to
Section 8
for
details on the boxed processor.
6.1.1
Thermal Specifications
To allow the optimal operation and long-term reliability of Intel processor-based
systems, the processor must remain within the minimum and maximum case
temperature (T
CASE
) specifications as defined by the applicable thermal profile.
Thermal solutions not designed to provide this level of thermal capability may affect the
long-term reliability of the processor and system. For more details on thermal/
mechanical design guidelines.
The Quad-Core Intel® Xeon® Processor 5300 Series implement a methodology for
managing processor temperatures which is intended to support acoustic noise
reduction through fan speed control and to assure processor reliability. Selection of the
appropriate fan speed is based on the relative temperature data reported by the
processor’s Platform Environment Control Interface (PECI) bus as described in
Section 6.4
. The temperature reported over PECI is always a negative value and
represents a delta below the onset of thermal control circuit (TCC) activation, as
indicated by PROCHOT# (see
Section 6.3
, Processor Thermal Features). Systems that
implement fan speed control must be designed to use this data. Systems that do not
alter the fan speed only need to guarantee the case temperature meets the thermal
profile specifications.
The Quad-Core Intel® Xeon® Processor E5300 (see
Figure 6-1
;
Table 6-2
), Quad-
Core Intel® Xeon® Processor L5300 Series (see
Figure 6-4
;
Table 6-9
), and Quad-Core
Intel® Xeon® Processor X5365 Series (see
Figure 6-3
;
Table 6-7
) support a single
Thermal Profile. For these processors, it is expected that the Thermal Control Circuit
(TCC) would only be activated for very brief periods of time when running the most
Summary of Contents for Quad-Core Xeon
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Page 84: ...Signal Definitions 86 Quad Core Intel Xeon Processor 5300 Series Datasheet...
