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Intel Quad-Core Xeon, Datasheet

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Intel Quad-Core Xeon Datasheet Download Page 28

Electrical Specifications

30

Quad-Core Intel® Xeon® Processor 5300 Series Datasheet

I

CC_RESET

ICC_RESET for Quad-Core Intel® 

Xeon® Processor E5300  core with 

multiple VID
Launch - FMB

90

A

17

I

CC

I

CC

 for Quad-Core Intel® Xeon® 

Processor X5300 Series core with 

multiple VID
Launch - FMB

125

A

4,5,6,9

I

CC_RESET

I

CC_RESET

 for Quad-Core Intel® 

Xeon® Processor X5300 Series core 

with multiple VID
Launch - FMB

125

A

17

I

CC

I

CC

 for Quad-Core Intel® Xeon® 

Processor X5365 Series processor 

core with multiple VID
Launch - FMB

150

A

4,5,6,9

I

CC_RESET

I

CC_RESET

 for Quad-Core Intel® 

Xeon® Processor X5365 Series 

processor core with multiple VID
Launch - FMB

150

A

17

I

CC

I

CC

 for Quad-Core Intel® Xeon® 

Processor L5300 Series processor 

core with multiple VID
Launch - FMB

60

A

4,5,6,9

I

CC_RESET

I

CC_RESET

 for Quad-Core Intel® 

Xeon® Processor L5300 Series 

processor core with multiple VID
Launch - FMB

60

A

17

I

CC

I

CC

 for Quad-Core Intel® Xeon® 

Processor L5318 core with multiple 

VID
Launch - FMB

50

A

4,5,6,9

I

CC_RESET

I

CC_RESET

 for Quad-Core Intel® 

Xeon® Processor L5318 core with 

multiple VID
Launch - FMB

50

A

17

I

TT

I

CC

 for V

TT

 supply before V

CC

 stable

I

CC

 for V

TT

 supply after V

CC

 stable

8.0

7.0

A

A

15

I

CC_TDC

Thermal Design Current (TDC) 

Quad-Core Intel® Xeon® Processor 

E5300 
Launch - FMB

70

A

6,14

I

CC_TDC

Thermal Design Current (TDC) 

Quad-Core Intel® Xeon® Processor 

X5300 Series
Launch - FMB

110

A

6,14

I

CC_TDC

Thermal Design Current (TDC) 

Quad-Core Intel® Xeon® Processor 

X5365 Series
Launch - FMB

130

A

6,14

I

CC_TDC

Thermal Design Current (TDC) 

Quad-Core Intel® Xeon® Processor 

L5300 Series
Launch - FMB

50

A

6,14

Table 2-12. Voltage and Current Specifications  (Sheet 2 of 3)

Symbol

Parameter

Min

Typ

Max

Unit

Notes 

1,11

Summary of Contents for Quad-Core Xeon

Page 1: ...Order Number 315569 003 Quad Core Intel Xeon Processor 5300 Series Datasheet September 2007...

Page 2: ...uture changes to them The Quad Core Intel Xeon Processor 5300 Series may contain design defects or errors known as errata which may cause the product to deviate from published specifications Current c...

Page 3: ...aracteristics 26 2 10 2 Input Device Hysteresis 27 2 11 Mixing Processors 27 2 12 Absolute Maximum and Minimum Ratings 28 2 13 Processor DC Specifications 29 2 13 1 Flexible Motherboard Guidelines FMB...

Page 4: ...ink Support CEK 121 8 3 Electrical Requirements 121 8 3 1 Fan Power Supply Active CEK 121 8 3 2 Boxed Processor Cooling Requirements 122 8 4 Boxed Processor Contents 123 9 Debug Tools Specifications 1...

Page 5: ...rement Location 98 6 7 Thermal Monitor 2 Frequency and Voltage Ordering 100 6 8 PECI Topology 102 6 9 Conceptual Fan Control Diagram For A PECI Based Platform 103 7 1 Stop Clock State Machine 108 8 1...

Page 6: ...ignal Definitions 79 6 1 Quad Core Intel Xeon Processor E5300 Series Thermal Specifications 89 6 2 Quad Core Intel Xeon Processor E5300 Series Thermal Profile Table 90 6 3 Quad Core Intel Xeon Process...

Page 7: ...sheet 7 Revision History Revision Description Date 001 Initial Release November 2006 002 Added Quad Core Intel Xeon Processor L5300 Series March 2007 003 Included the G step information Added the Quad...

Page 8: ...8 Quad Core Intel Xeon Processor 5300 Series Datasheet...

Page 9: ...in high temperature situations Enhanced Intel SpeedStep Technology provides power management capabilities to servers and workstations The Quad Core Intel Xeon Processor 5300 Series features include A...

Page 10: ...ill support the power requirements of all frequencies of the processors including Flexible Motherboard Guidelines FMB see Section 2 13 1 Refer to the appropriate platform design guidelines for impleme...

Page 11: ...Xeon Processor E5300 Series SKU Quad Core Intel Xeon Processor X5300 Series An accelerated performance version of the Quad Core Intel Xeon Processor 5300 Series For this document Quad Core Intel Xeon...

Page 12: ...connected to any supply voltages have any I Os biased or receive any clocks Upon exposure to free air that is unsealed packaging or a device removed from packaging material the processor must be handl...

Page 13: ...ermination voltage Note In some Intel processor EMTS documents VTT is instead called VCCP 1 2 State of Data The data contained within this document is the most accurate information available by the pu...

Page 14: ...ntel representative for the latest revision of these documents Quad Core Intel Xeon Processor 5300 Series Thermal Mechanical Design Guidelines Clovertown Processor Boundary Scan Descriptive Language B...

Page 15: ...EF_DATA_MID GTLREF_DATA_END GTLREF_ADD_MID and GTLREF_ADD_END which are used by the receivers to determine if a signal is a logical 0 or a logical 1 GTLREF_DATA_MID and GTLREF_DATA_END are used for th...

Page 16: ...m a running condition Care must be taken in the baseboard design to ensure that the voltage provided to the processor remains within the specifications listed in Table 2 12 Failure to do so can result...

Page 17: ...mum speed of the processor It is possible to override this setting using software see the Conroe and Woodcrest Processor Family BIOS Writer s Guide This permits operation at lower frequencies than the...

Page 18: ...ions Table 2 2 defines the possible combinations of the signals and the frequency associated with each combination The frequency is determined by the processor s chipset and clock synthesizer All FSB...

Page 19: ...ded in Table 2 3 is not related in any way to previous Intel Xeon processors or voltage regulator designs If the processor socket is empty VID 6 1 111111 or the voltage regulation circuit cannot suppl...

Page 20: ...5 mV VCC_MAX 7A 1 1 1 1 0 1 0 8500 3C 0 1 1 1 1 0 1 2375 78 1 1 1 1 0 0 0 8625 3A 0 1 1 1 0 1 1 2500 76 1 1 1 0 1 1 0 8750 38 0 1 1 1 0 0 1 2625 74 1 1 1 0 1 0 0 8875 36 0 1 1 0 1 1 1 2750 72 1 1 1 0...

Page 21: ...tform design guidelines For unused AGTL input or I O signals use pull up resistors of the same value as the on die termination resistors RTT For details see Table 2 20 Some TAP CMOS inputs and outputs...

Page 22: ...their respective strobe lines data and address as well as rising edge of BCLK0 Asynchronous signals are still present A20M IGNNE etc and can become active at any time during the clock cycle Table 2 6...

Page 23: ..._MID GTLREF_DATA_END LL_ID 1 0 MS_ID 1 0 PECI RESERVED SKTOCC TESTHI 11 10 TESTHI 7 0 TESTIN1 TESTIN2 VCC VCC_DIE_SENSE VCC_DIE_SENSE2 VCCPLL VID_SELECT VSS_DIE_SENSE VSS_DIE_SENSE2 VSS VTT VTT_OUT VT...

Page 24: ...and TRST Two copies of each signal may be required with each driving a different voltage level 2 10 Platform Environmental Control Interface PECI DC Specifications PECI is an Intel proprietary one wir...

Page 25: ...core frequency number of cores and have the same internal cache sizes Mixing components operating at different internal clock frequencies is not supported and will not be validated by Intel Combining...

Page 26: ...g absolute maximum and minimum ratings neither functionality nor long term reliability can be expected Moreover if a device is subjected to these conditions for any length of time then when returned t...

Page 27: ...elines FMB The Flexible Motherboard FMB guidelines are estimates of the maximum values the Quad Core Intel Xeon Processor 5300 Series will have over certain time periods The values are only estimates...

Page 28: ...h FMB 60 A 4 5 6 9 ICC_RESET ICC_RESET for Quad Core Intel Xeon Processor L5300 Series processor core with multiple VID Launch FMB 60 A 17 ICC ICC for Quad Core Intel Xeon Processor L5318 core with mu...

Page 29: ...D transitions below the specified VID 11 Individual processor VID values may be calibrated during manufacturing such that two devices at the same frequency may have different VID settings 12 This spec...

Page 30: ...tion Notes 1 Processor or voltage regulator thermal protection circuitry should not trip for load currents greater than ICC_TDC 2 Not 100 tested Specified by design characterization Notes 1 Processor...

Page 31: ...es 1 Processor or voltage regulator thermal protection circuitry should not trip for load currents greater than ICC_TDC Figure 2 4 Quad Core Intel Xeon Processor X5365 Series Load Current versus Time...

Page 32: ...s Sheet 1 of 2 ICC A VCC_Max V VCC_Typ V VCC_Min V Notes 0 VID 0 000 VID 0 015 VID 0 030 1 2 3 5 VID 0 006 VID 0 021 VID 0 036 1 2 3 10 VID 0 013 VID 0 028 VID 0 043 1 2 3 15 VID 0 019 VID 0 034 VID 0...

Page 33: ...ecify voltage limits at the die measured at the VCC_DIE_SENSE and VSS_DIE_SENSE lands and across the VCC_DIE_SENSE2 and VSS_DIE_SENSE2 lands Voltage regulation feedback for voltage regulator circuits...

Page 34: ...cessor VID information 3 Refer to Table 2 13 for VCCStatic and Transient Tolerance 4 The load lines specify voltage limits at the die measured at the VCC_DIE_SENSE and VSS_DIE_SENSE lands and the VCC_...

Page 35: ...r socket load line guidelines and VR implementation Please refer to the appropriate platform design guide for details on VR implementation Figure 2 9 Quad Core Intel Xeon Processor L5300 Series VCC St...

Page 36: ...to the appropriate platform design guide for details on VR implementation 50 VID 0 063 VID 0 073 VID 0 083 1 2 3 55 VID 0 069 VID 0 079 VID 0 089 1 2 3 60 VID 0 075 VID 0 085 VID 0 095 1 2 3 65 VID 0...

Page 37: ...ck for voltage regulator circuits must also be taken from processor VCC_DIE_SENSE and VSS_DIE_SENSE lands and VCC_DIE_SENSE2 and VSS_DIE_SENSE2 lands Refer to the Voltage Regulator Module VRM and Ente...

Page 38: ...r VCC_DIE_SENSE and VSS_DIE_SENSE lands and VCC_DIE_SENSE2 and VSS_DIE_SENSE2 lands Refer to the Voltage Regulator Module VRM and Enterprise Voltage Regulator Down EVRD 11 0 Design Guidelines for sock...

Page 39: ...guidelines and VR implementation Please refer to the appropriate platform design guide for details on VR implementation Notes 1 Unless otherwise noted all specifications in this table apply to all pr...

Page 40: ...short transient overshoot events where VCC exceeds the VID voltage when transitioning from a high to low current load condition This overshoot cannot exceed VID VOS_MAX VOS_MAX is the maximum allowabl...

Page 41: ...ntegrated into the processor silicon See Table 2 7 for details on which signals do not include on die termination Please refer to Table 2 20 for RTT values Valid high and low levels are determined by...

Page 42: ...mV and 455 mV of the clock swing 3 Crossing Voltage is defined as the instantaneous voltage value when the rising edge of BCLK0 is equal to the falling edge of BCLK1 4 VHavg is the statistical averag...

Page 43: ...des input threshold hysteresis 9 The crossing point must meet the absolute and relative crossing point specifications simultaneously 10 VHavg can be measured directly using Vtop on Agilent and High on...

Page 44: ...ion Crossing Voltage Threshold Region VH VL Overshoot Undershoot Ringback Margin Rising Edge Ringback Falling Edge Ringback BCLK0 BCLK1 Crossing Voltage Tp Tp T1 BCLK 1 0 period 660 670 680 690 700 71...

Page 45: ...1 socket The package components shown in Figure 3 1 include the following Integrated Heat Spreader IHS Thermal Interface Material TIM Processor Die Package Substrate Landside capacitors Package Lands...

Page 46: ...00 Series Datasheet Note Guidelines on potential IHS flatness variation with socket load plate actuation and installation of the cooling solution is available in the processor Thermal Mechanical Desig...

Page 47: ...Quad Core Intel Xeon Processor 5300 Series Datasheet 49 Mechanical Specifications Figure 3 3 Processor Package Drawing Sheet 2 of 3...

Page 48: ...Mechanical Specifications 50 Quad Core Intel Xeon Processor 5300 Series Datasheet Figure 3 4 Processor Package Drawing Sheet 3 of 3...

Page 49: ...3 These specifications are based on limited testing for design characterization Loading limits are for the LGA771 socket 4 Dynamic compressive load applies to all board thickness 5 Dynamic loading is...

Page 50: ...ling guidelines are for the package only and do not include the limits of the processor socket 3 5 Package Insertion Specifications The Quad Core Intel Xeon Processor 5300 Series can be inserted and r...

Page 51: ...he top and bottom view of the processor land coordinates respectively The coordinates are referred to throughout the document to identify processor lands Figure 3 5 Processor Top side Markings Example...

Page 52: ...16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH AJ AK AL AM AN A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH AJ AK AL AM...

Page 53: ...2 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH AJ AK AL AM AN A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH A...

Page 54: ...Mechanical Specifications 56 Quad Core Intel Xeon Processor 5300 Series Datasheet...

Page 55: ...t A12 U5 Source Sync Input Output A13 U4 Source Sync Input Output A14 V5 Source Sync Input Output A15 V4 Source Sync Input Output A16 W5 Source Sync Input Output A17 AB6 Source Sync Input Output A18 W...

Page 56: ...Input COMP3 R1 Power Other Input D00 B4 Source Sync Input Output Table 4 1 Land Listing by Land Name Sheet 3 of 23 Pin Name Pin No Signal Buffer Type Direction D01 C5 Source Sync Input Output D02 A4 S...

Page 57: ...put Output D52 C14 Source Sync Input Output Table 4 1 Land Listing by Land Name Sheet 5 of 23 Pin Name Pin No Signal Buffer Type Direction D53 B15 Source Sync Input Output D54 C18 Source Sync Input Ou...

Page 58: ...ut MCERR AB3 Common Clk Input Output MS_ID0 W1 Power Other Output MS_ID1 V1 Power Other Output PECI G5 Power Other Input Output PROCHOT AL2 Open Drain Asynchronous Output PWRGOOD N1 CMOS Asynchronous...

Page 59: ...her VCC AB8 Power Other VCC AC23 Power Other VCC AC24 Power Other VCC AC25 Power Other Table 4 1 Land Listing by Land Name Sheet 9 of 23 Pin Name Pin No Signal Buffer Type Direction VCC AC26 Power Oth...

Page 60: ...AJ9 Power Other VCC AK11 Power Other Table 4 1 Land Listing by Land Name Sheet 11 of 23 Pin Name Pin No Signal Buffer Type Direction VCC AK12 Power Other VCC AK14 Power Other VCC AK15 Power Other VCC...

Page 61: ...Other VCC K30 Power Other VCC K8 Power Other Table 4 1 Land Listing by Land Name Sheet 13 of 23 Pin Name Pin No Signal Buffer Type Direction VCC L8 Power Other VCC M23 Power Other VCC M24 Power Other...

Page 62: ...24 Power Other VSS AA25 Power Other VSS AA26 Power Other VSS AA27 Power Other Table 4 1 Land Listing by Land Name Sheet 15 of 23 Pin Name Pin No Signal Buffer Type Direction VSS AA28 Power Other VSS A...

Page 63: ...S AJ28 Power Other VSS AJ29 Power Other Table 4 1 Land Listing by Land Name Sheet 17 of 23 Pin Name Pin No Signal Buffer Type Direction VSS AJ30 Power Other VSS AJ4 Power Other VSS AK10 Power Other VS...

Page 64: ...her VSS E26 Power Other VSS E27 Power Other Table 4 1 Land Listing by Land Name Sheet 19 of 23 Pin Name Pin No Signal Buffer Type Direction VSS E28 Power Other VSS E8 Power Other VSS F1 Power Other VS...

Page 65: ...ower Other Table 4 1 Land Listing by Land Name Sheet 21 of 23 Pin Name Pin No Signal Buffer Type Direction VSS V24 Power Other VSS V25 Power Other VSS V26 Power Other VSS V27 Power Other VSS V28 Power...

Page 66: ...68 Quad Core Intel Xeon Processor 5300 Series Datasheet VTT_OUT J1 Power Other Output VTT_SEL F27 Power Other Output Table 4 1 Land Listing by Land Name Sheet 23 of 23 Pin Name Pin No Signal Buffer Ty...

Page 67: ...ower Other AA27 VSS Power Other AA28 VSS Power Other AA29 VSS Power Other AA3 VSS Power Other AA30 VSS Power Other AA4 A21 Source Sync Input Output AA5 A23 Source Sync Input Output AA6 VSS Power Other...

Page 68: ...SERVED AE7 VSS Power Other Table 4 2 Land Listing by Land Number Sheet 3 of 20 Pin No Pin Name Signal Buffer Type Direction AE8 SKTOCC Power Other Output AE9 VCC Power Other AF1 TDO TAP Output AF10 VS...

Page 69: ...AH24 VSS Power Other AH25 VCC Power Other Table 4 2 Land Listing by Land Number Sheet 5 of 20 Pin No Pin Name Signal Buffer Type Direction AH26 VCC Power Other AH27 VCC Power Other AH28 VCC Power Oth...

Page 70: ...Other Table 4 2 Land Listing by Land Number Sheet 7 of 20 Pin No Pin Name Signal Buffer Type Direction AL17 VSS Power Other AL18 VCC Power Other AL19 VCC Power Other AL2 PROCHOT Open Drain Asynchrono...

Page 71: ...f 20 Pin No Pin Name Signal Buffer Type Direction B11 VSS Power Other B12 D13 Source Sync Input Output B13 RESERVED B14 VSS Power Other B15 D53 Source Sync Input Output B16 D55 Source Sync Input Outpu...

Page 72: ...Power Other D28 VTT Power Other D29 VTT Power Other Table 4 2 Land Listing by Land Number Sheet 11 of 20 Pin No Pin Name Signal Buffer Type Direction D3 VSS Power Other D30 VTT Power Other D4 HIT Comm...

Page 73: ...Output G18 D35 Source Sync Input Output G19 DSTBP2 Source Sync Input Output G2 COMP2 Power Other Input Table 4 2 Land Listing by Land Number Sheet 13 of 20 Pin No Pin Name Signal Buffer Type Direction...

Page 74: ...J9 VCC Power Other Table 4 2 Land Listing by Land Number Sheet 15 of 20 Pin No Pin Name Signal Buffer Type Direction K1 LINT0 CMOS Asynchronous Input K2 VSS Power Other K23 VCC Power Other K24 VCC Pow...

Page 75: ...S Power Other Table 4 2 Land Listing by Land Number Sheet 17 of 20 Pin No Pin Name Signal Buffer Type Direction P5 A37 Source Sync Input Output P6 A04 Source Sync Input Output P7 VSS Power Other P8 VC...

Page 76: ...Power Other W1 MS_ID0 Power Other Output W2 TESTIN1 Power Other Input W23 VCC Power Other W24 VCC Power Other W25 VCC Power Other W26 VCC Power Other Table 4 2 Land Listing by Land Number Sheet 19 of...

Page 77: ...ADS Address Strobe is asserted to indicate the validity of the transaction address on the A 37 3 4 lands All bus agents observe the ADS activation to begin parity checking protocol checking address d...

Page 78: ...tools to determine processor debug readiness BPM5 provides PREQ Probe Request functionality for the TAP port PREQ is used by debug tools to request debug operation of the processors BPM 5 4 must be b...

Page 79: ...the system board DBR is used by a debug port interposer so that an in target probe can drive reset If a debug port connector is implemented in the system DBR is a no connect on the Quad Core Intel Xeo...

Page 80: ...Circuit TCC GTLREF_ADD_MID GTLREF_ADD_END I GTLREF_ADD determines the signal reference level for AGTL address and common clock input lands GTLREF_ADD is used by the AGTL receivers to determine if a si...

Page 81: ...s to the system that a transaction must occur atomically This signal must connect the appropriate pins of all processor FSB agents For a locked sequence of transactions LOCK is asserted from the begin...

Page 82: ...and must connect the appropriate pins of all processor FSB agents 3 RSP I RSP Response Parity is driven by the response agent the agent responsible for completion of the current transaction during ass...

Page 83: ...st connect the appropriate pins of all FSB agents TRST I TRST Test Reset resets the Test Access Port TAP logic TRST must be driven low during power on Reset VCCPLL I The Quad Core Intel Xeon Processor...

Page 84: ...Signal Definitions 86 Quad Core Intel Xeon Processor 5300 Series Datasheet...

Page 85: ...ications To allow the optimal operation and long term reliability of Intel processor based systems the processor must remain within the minimum and maximum case temperature TCASE specifications as def...

Page 86: ...y TCASE_MAX P_PROFILE_MIN P_PROFILE_MIN is defined as the processor power at which TCASE calculated from the thermal profile is equal to 50 C Analysis indicates that real applications are unlikely to...

Page 87: ...ns Thermal Mechanical Design Guidelines for details on system thermal solution design thermal profiles and environmental considerations Notes 1 These values are specified at VCC_MAX for all processor...

Page 88: ...l implementation details Figure 6 1 Quad Core Intel Xeon Processor E5300 Series Thermal Profile 40 45 50 55 60 65 70 0 10 20 30 40 50 60 70 80 Power W Tcase C Thermal Profile Y 0 293 x 42 6 40 45 50 5...

Page 89: ...s Thermal Profile A will result in increased probability of TCC activation and may incur measurable performance loss See Section 6 3 for details on TCC activation 3 Quad Core Intel Xeon Processor X530...

Page 90: ...5 50 2 50 51 1 55 51 9 60 52 8 65 53 6 70 54 5 75 55 3 80 56 2 85 57 0 90 57 9 95 58 7 100 59 6 105 60 5 110 61 3 115 62 2 120 63 0 Table 6 5 Quad Core Intel Xeon Processor X5300 Series Thermal Profil...

Page 91: ...ization 5 Power specifications are defined at all VIDs found in Table 2 3 The Quad Core Intel Xeon Processor L5300 Series may be shipped under multiple VIDs for each frequency 6 FMB or Flexible Mother...

Page 92: ...ASE 4 These specifications are based on silicon characterization 5 Power specifications are defined at all VIDs found in Table 2 3 The Quad Core Intel Xeon Processor L5300 Series may be shipped under...

Page 93: ...exceeds VCC_MAX at specified ICC Please refer to the loadline specifications in Section 2 2 Maximum Power is the highest power the processor will dissipate regardless of its VID Maximum Power is meas...

Page 94: ...that constitute the thermal profile 2 Refer to the Quad Core Intel Xeon Processor L5318 Thermal Mechanical Design Guidelines for system and environmental implementation details 3 The Nominal Thermal...

Page 95: ...logy The minimum and maximum case temperatures TCASE are specified in Table 6 1 through Table 6 7 and are measured at the geometric top center of the processor integrated heat spreader IHS Figure 6 6...

Page 96: ...d Thermal Monitor TM2 The TM1 and TM2 must both be enabled in BIOS for the processor to be operating within specifications When both are enabled TM2 will be activated first and TM1 will be added if TM...

Page 97: ...e processor In addition a thermal solution that is significantly under designed may not be capable of cooling the processor even when the TCC is active continuously Refer to the Quad Core Intel Xeon P...

Page 98: ...the operating frequency and voltage transition back to the normal system operating point Transition of the VID code will occur first in order to insure proper operation once the processor reaches its...

Page 99: ...ip temperature or the case temperature Thermal solutions must be designed to the processor specifications and cannot be adjusted based on experimental measurements of TCASE or PROCHOT 6 3 6 FORCEPR Si...

Page 100: ...een the host and client devices Also data transfer speeds across the PECI interface are negotiable within a wide range 2 Kbps to 2 Mbps The PECI interface on Quad Core Intel Xeon Processor 5300 Series...

Page 101: ...times to determine the appropriate sample rate based on the controller s fan control algorithm and targeted response rate The key items to take into account when settling on a fan control algorithm a...

Page 102: ...to provide reliable thermal data System designs should implement a default power on condition that ensures proper processor operation during the time frame when reliable data is not available via PECI...

Page 103: ...ow Power States Quad Core Intel Xeon Processor 5300 Series support the Extended HALT state also referred to as C1E in addition to the HALT state and Stop Grant state to reduce power consumption by sto...

Page 104: ...ftware Developer s Manual Volume III System Programming Guide for more information The system can generate a STPCLK while the processor is in the HALT state When the system deasserts STPCLK the proces...

Page 105: ...e 34W 3 G 0 stepping SKUs with Extended HALT state are specified at TCASE 40 C Table 7 2 Extended HALT Maximum Power B 3 Stepping G 0 Stepping Symbol FSB Speed MHz TCASE C Max W TCASE C Max W Notes PE...

Page 106: ...s state In addition all other input pins on the front side bus should be driven to the inactive state BINIT will not be serviced while the processor is in Stop Grant state The event will be latched an...

Page 107: ...e in Stop Grant state or in HALT state During a snoop or interrupt transaction the processor enters the HALT Grant Snoop state The processor will stay in this state until the snoop on the front side b...

Page 108: ...the four processor cores is selected for that processor package Note that the front side bus is not altered only the internal core frequency is changed In order to run at reduced power consumption th...

Page 109: ...primarily designed to be used in a pedestal chassis where sufficient air inlet space is present and strong side directional airflow is not an issue The 1U passive 3U active combination solution with t...

Page 110: ...ed that the CEK spring will ship with the base board and be pre attached prior to shipping Figure 8 2 Boxed Quad Core Intel Xeon Processor 5300 Series 2U Passive Heat Sink Figure 8 3 2U Passive Quad C...

Page 111: ...rocessor will be shipped with an unattached thermal solution Clearance is required around the thermal solution to ensure unimpeded airflow for proper cooling The physical space requirements and dimens...

Page 112: ...Boxed Processor Specifications 114 Quad Core Intel Xeon Processor 5300 Series Datasheet Figure 8 4 Top Side Board Keepout Zones Part 1...

Page 113: ...Quad Core Intel Xeon Processor 5300 Series Datasheet 115 Boxed Processor Specifications Figure 8 5 Top Side Board Keepout Zones Part 2...

Page 114: ...Boxed Processor Specifications 116 Quad Core Intel Xeon Processor 5300 Series Datasheet Figure 8 6 Bottom Side Board Keepout Zones...

Page 115: ...Quad Core Intel Xeon Processor 5300 Series Datasheet 117 Boxed Processor Specifications Figure 8 7 Board Mounting Hole Keepout Zones...

Page 116: ...Boxed Processor Specifications 118 Quad Core Intel Xeon Processor 5300 Series Datasheet Figure 8 8 Volumetric Height Keep Ins...

Page 117: ...Quad Core Intel Xeon Processor 5300 Series Datasheet 119 Boxed Processor Specifications Figure 8 9 4 Pin Fan Cable Connector For Active CEK Heat Sink...

Page 118: ...Boxed Processor Specifications 120 Quad Core Intel Xeon Processor 5300 Series Datasheet Figure 8 10 4 Pin Base Board Fan Header For Active CEK Heat Sink...

Page 119: ...such that the dynamic loads from the heat sink are transferred to the chassis pan via the stiff screws and standoffs The retention scheme reduces the risk of package pullout and solder joint failures...

Page 120: ...sign considerations Meeting the processor s temperature specifications is also the function of the thermal design of the entire system and ultimately the responsibility of the system integrator The pr...

Page 121: ...sink fan Use of the active configuration in a 2U rackmount chassis is not recommended It is recommended that the ambient air temperature outside of the chassis be kept at or below 35 C The air passing...

Page 122: ...or 5300 Series Datasheet The other items listed in Figure 8 3 that are required to compete this solution will be shipped with either the chassis or boards They are as follows CEK Spring supplied by ba...

Page 123: ...multiplexing scheme In general the information in this chapter may be used as a basis for including all run control tools in Quad Core Intel Xeon Processor 5300 Series based systems designs including...

Page 124: ...ytic capacitors fall inside of the keepout volume for the LAI In this case it is necessary to move these capacitors to the backside of the board before using the LAI Additionally note that it is possi...

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