Technical Reference
77
Table 36 provides maximum case temperatures for the components that are sensitive to thermal
changes. The operating temperature, current load, or operating frequency could affect case
temperatures. Maximum case temperatures are important when considering proper airflow to cool
the board.
Table 36. Thermal Considerations for Components
Component
Temperature
Intel 82801G ICH7-R/ICH7-DH
110
o
C (under bias)
Intel
82975X MCH
99
o
C (under bias)
Intel Pentium 4 processor
For processor case temperature, see processor datasheets and
processor specification updates
Processor voltage regulator area
120
o
C (under bias)
NOTE
For hardware monitoring application software, an alert point of 110
o
C is recommended as a
starting point for the processor voltage regulator area.
For information about
Refer to
Intel Pentium 4 processor datasheets and specification updates
Section 1.2, page 15
2.12 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate
repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 ºC. The MTBF for the board is 99,721
hours.
Summary of Contents for D975XBX
Page 27: ...Product Description 27 O...
