Thermal Management
54
Datasheet
system that is shipped with the customer’s platform and Intel Graphics Dynamic
Frequency is enabled, the Intel Turbo Boost Technology driver and graphics driver must
be installed and operating to keep the product operating within specification limits.
Caution:
The TURBO_POWER_CURRENT_LIMIT MSR is exclusively reserved for Intel Turbo
Technology Driver use. Under no circumstances should this value be altered from the
default register value after reset of the processor. Altering this MSR value may result in
unpredictable behavior.
5.1.2
Intel Graphics Dynamic Frequency Thermal Design
Considerations and Specifications
When designing a thermal solution for Intel Graphics Dynamic frequency enabled
processor:
•
Both component TDPs as well as extreme thermal power levels for the processor
core and integrated graphics and memory controller must be considered.
•
Note that the processor can consume close to its maximum thermal power limit
more frequently, and for prolonged periods of time.
•
One must ensure that the component T
j,max
limits are not exceeded when either
component is operating at its extreme thermal power limit.
There are two “extreme” design points:
•
The processor core operating at maximum thermal power level (which is greater
than its component TDP) and the integrated graphics and memory controller
operating at its minimum thermal power.
•
The integrated graphics operates at its maximum thermal power level, while the
processor core consumes the remaining thermal power budget.
In both cases, the combined component thermal power will not exceed the total MCP
package power limit. The design approach accommodating two extreme power levels is
referred to as a “two-point” design.
The following notes apply to
and
.
Note
Definition
1
The component TDPs given are not the maximum power the components can generate. Analysis
indicates that real applications are unlikely to cause the processor to consume the theoretical
maximum power dissipation for sustained periods of time.
2
A range of power is to be expected among the components due to the natural variation in the
manufacturing process. Nevertheless, the individual component powers are not to exceed the
component TDPs specified.
3
Concurrent package power refers to the actual power consumed by the package while TDP
applications are running simultaneously by the processor core and the integrated graphics
controller. An example of this could be the processor core running a Prime95* application, and the
integrated graphics core running a Star Wars: Jedi Knight* menu simultaneously.
4
The thermal solution needs to ensure that the temperatures of both components do not exceed the
maximum junction temperature (T
j,max
) limit, as measured by the DTS and the critical temperature
bit. Please refer to processor Specification Update for Tjmax value per sku.
