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Intel
®
Itanium
®
Processor 9300 Series and 9500 Series Datasheet
129
Mechanical Specifications
4.3
Processor Component Keepout Zones
The processor may contain components on the substrate that define component
keepout zone requirements. A thermal and mechanical solution design must not intrude
into the required keepout zones. Decoupling capacitors are typically mounted to both
the top-side and bottom-side of the package substrate. See
for Intel
®
Itanium
®
9300 Series Processor keepout zones and
for Intel
®
Itanium
®
9500 Series Processor keepout zones.
4.4
Package Loading Specifications
provides dynamic and static load specifications for the processor package.
These mechanical load limits should not be exceeded during heatsink assembly,
shipping conditions, or standard use condition. Also, any mechanical system or
component testing should not exceed the maximum limits. The processor package
substrate should not be used as a mechanical reference or load-bearing surface for
thermal and mechanical solutions.
4.5
Package Handling Guidelines
includes a list of guidelines on package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
Note:
1.
A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2.
A tensile load is defined as a pulling load applied to the IHS in the direction normal to the IHS surface.
3.
A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top
surface.
4.
These guidelines are based on limited testing for design characterization.
The Intel
®
Itanium
®
Processor 9300 Series can be inserted into and removed from a
LGA1248 socket and engaged and disengaged with the Ararat voltage regulator up to a
maximum limit as specified in
Table 4-1.
Processor Loading Specifications
Parameter
Maximum
Unit
Notes
Static Compressive Load
1000
N
1, 2, 3
Notes:
1. These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top surface.
2. This is the allowable static force that can be applied by the heatsink and retention solution to maintain the
heatsink and processor interface.
3. These parameters are based on limited testing for design characterization. Loading limits are for the package
only and do not include the limits of the processor socket.
Dynamic Compressive Load
t < 30 ms
1793
N
Transient
t < 1 s
1090
N
Table 4-2.
Package Handling Guidelines
Parameter
Maximum Recommended
Unit
Notes
Shear
356
N
1, 4
Tensile
156
N
2, 4
Torque
8
N-m
3, 4
Summary of Contents for BX80569Q9550 - Core 2 Quad 2.83 GHz Processor
Page 10: ...Introduction 10 Intel Itanium Processor 9300 Series and 9500 Series Datasheet ...
Page 22: ...Introduction 22 Intel Itanium Processor 9300 Series and 9500 Series Datasheet ...
Page 72: ...Electrical Specifications 72 Intel Itanium Processor 9300 Series and 9500 Series Datasheet ...
Page 118: ...Pin Listing 118 Intel Itanium Processor 9300 Series and 9500 Series Datasheet ...
Page 132: ...Mechanical Specifications 132 Intel Itanium Processor 9300 Series and 9500 Series Datasheet ...
Page 142: ...Thermal Specifications 142 Intel Itanium Processor 9300 Series and 9500 Series Datasheet ...
Page 170: ...170 Intel Itanium Processor 9300 Series and 9500 Series Datasheet ...