Datasheet
33
Package Mechanical Specifications and Pin Information
4
Package Mechanical
Specifications and Pin
Information
4.1
Package Mechanical Specifications
The processor is available in 478-pin Micro-FCPGA packages. The package mechanical
dimensions are shown in
Figure 9
through
Figure 13
.
The mechanical package pressure specifications are in a direction normal to the surface
of the processor. This protects the processor die from fracture risk due to uneven die
pressure distribution under tilt, stack-up tolerances and other similar conditions. These
specifications assume that a mechanical attach is designed specifically to load one type
of processor.
Moreover, the processor package substrate should not be used as a mechanical
reference or load-bearing surface for the thermal or mechanical solution.
Summary of Contents for BX80532PG3200D
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