Intel 845GE, Thermal Design Manual

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R
4 Intel
®
845GE / 845PE Chipset (G)MCH Thermal Design Guide
Figures
Figure 1. Heatsink Assembly: Heatsink, Clip Frame, Clip Lever ....................................12
Figure 2. Heatsink Assembly Placement and Actuation.................................................12
Figure 3. DIMM Airflow Measurement Location .............................................................14
Figure 4. 90 Degree Angle Attach Methodology (not to scale) .......................................16
Figure 5. 0 Degree Angle Attach Heatsink Modifications (not to scale) ..........................17
Figure 6. 0 Degree Angle Attach Methodology (not to scale) .........................................17
Figure 7. 0 Degree Thermal Solution Decision Flowchart for 0 °C .................................18
Figure 8. Intel
®
(G)MCH Components Modeled .............................................................20
Figure 9. Intel
®
(G)MCH Clip Assembly.........................................................................23
Figure 10. Intel
®
(G)MCH Clip Lateral Retention Tab Feature .......................................24
Figure 11. Intel
®
(G)MCH Clip Frame and Lever ...........................................................25
Figure 12. Intel
®
(G)MCH FC-BGA Package Dimensions (Top and Side View)..............29
Figure 13. Intel
®
(G)MCH FC-BGA Package Dimensions (Bottom View) .......................30
Figure 14. Intel
®
82845GE GMCH / 82845PE MCH Keep-Out Restriction .....................31
Tables
Table 1. Specification Summary .....................................................................................8
Table 2. Reliability Validation........................................................................................13
Table 3. Maximum (G)MCH Local Ambient (T
A
) Recommendations..............................14
Table 4. Intel
®
(G)MCH Maximum Case Temperature...................................................15
Table 5. Intel
®
82845PE MCH Thermal Design Power ..................................................18
Table 6. Intel
®
82845GE GMCH Thermal Design Power ...............................................18
Table 7. Chomerics T710 TIM Performance (at 50 °C as a Function of Attach Pressure)19
Table 8. TDP Dissipation for Various Airflow Speeds ....................................................20