Appendix A: Package Dimensions
R
Intel
®
845GE / 845PE Chipset (G)MCH Thermal Design Guide
29
Appendix A: Package Dimensions
This appendix provides package dimensions and keep-out zone requirements for the 82845GE
GMCH / 8245PE MCH.
Figure 12. Intel
®
(G)MCH FC-BGA Package Dimensions (Top and Side View)
Pkg760_Side-Top
Units = Millimeters
1.08 ±0.06
Die
0.200
A
Side View
Substrate
0.500 ±0.070
See Detail D
37.50 ±0.050
Top View
37.50 ±0.05
17.9250
16.9500
Detail A
Detail A
Detail B
Detail C
18.75
0.57 ±0.1
0.57 ±0.1
1.5 ±0.05
Detail C
3 x 0.07
Detail D
0.74 ±0.025
0.100 ±0.025
Die Solder
Bumps
Underfill
Epoxy
ϕ
0.6500 ±0.05
ϕ
0.500
Detail A
A
C
0.203
B
ϕ
1.1500 ±0.05
ϕ
1.00
Detail B
A
C
0.203
B
18.75 17.9250
16.9500
